ZHCSAR7A February   2013  – September 2024 UCC27532

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Feature Description
      1. 6.2.1 VDD Under Voltage Lockout
      2. 6.2.2 Input Stage
      3. 6.2.3 Enable Function
      4. 6.2.4 Output Stage
      5. 6.2.5 Power Dissipation
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
  9. Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 第三方米6体育平台手机版_好二三四免责声明
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

Output Stage

The output stage of the UCC27532 device is illustrated in Figure 6-2. The UCC27532 device features a unique architecture on the output stage which delivers the highest peak source current when it is most needed during the Miller plateau region of the power switch turn-on transition (when the power switch drain/collector voltage experiences dV/dt). The device output stage features a hybrid pull-up structure using a parallel arrangement of N-Channel and P-Channel MOSFET devices. By turning on the N-Channel MOSFET during a narrow instant when the output changes state from low to high, the gate driver device is able to deliver a brief boost in the peak sourcing current enabling fast turn on.

UCC27532 UCC27532 Gate Driver Output StageFigure 6-2 UCC27532 Gate Driver Output Stage

The ROH parameter (see Electrical Table) is a DC measurement and it is representative of the on-resistance of the P-Channel device only, since the N-Channel device is turned-on only during output change of state from low to high. Thus the effective resistance of the hybrid pull-up stage is much lower than what is represented by ROH parameter. The pull-down structure is composed of a N-Channel MOSFET only. The ROL parameter (see Section 5.4), which is also a DC measurement, is representative of true impedance of the pull-down stage in the device. In UCC27532, the effective resistance of the hybrid pull-up structure is approximately 3 x ROL.

The UCC27532 is capable of delivering 2.5-A source, 5-A Sink (asymmetrical drive) at VDD = 18 V. Strong sink capability in asymmetrical drive results in a very low pull-down impedance in the driver output stage which boosts immunity against the parasitic Miller turn-on (high slew rate dV/dt turn on) effect that is seen in both IGBT and FET power switches .

An example of a situation where Miller turn on is a concern is synchronous rectification (SR). In SR application, the dV/dt occurs on MOSFET drain when the MOSFET is already held in Off state by the gate driver. The current charging the CGD Miller capacitance during this high dV/dt is shunted by the pull-down stage of the driver. If the pull-down impedance is not low enough then a voltage spike can result in the VGS of the MOSFET, which can result in spurious turn on. This phenomenon is illustrated in Figure 6-3.

UCC27532 Low Pull-Down Impedance in UCC27532  (output stage mitigates Miller turn-on effect)Figure 6-3 Low Pull-Down Impedance in UCC27532 (output stage mitigates Miller turn-on effect)

The driver output voltage swings between VDD and GND providing rail-to-rail operation, thanks to the MOS output stage which delivers very low dropout. The presence of the MOSFET body diodes also offers low impedance to switching overshoots and undershoots. This means that in many cases, external Schottky diode clamps may be eliminated.