8.2.2.5 Selecting Gate Resistor RON/ROFF
Resistor RON and ROFF are sized to achieve the following:
- Limit ringing caused by parasitic inductances and capacitances.
- Limit ringing caused by high voltage/current switching dV/dt, dI/dt, and body diode reverse recovery.
- Fine-tune gate drive strength to optimize switching loss.
- Reduce electromagnetic interference (EMI).
As mentioned in Output Stage, the UCC27710 has a pull up structure with a P-channel MOSFET providing a peak source current of 0.5A.
For this example 10-Ω resistors for RON and 5.1-Ω resistors for ROFF were selected to provide damping for ringing and adequate gate drive current.
Equation 6.
Therefore the peak source current can be predicted with:
Equation 7.
Equation 8.
where
- RON: External turn-on resistance
- RGFET_Int: Power transistor internal gate resistance, found in the power transistor datasheet.
- IO+ = Peak source current. The maximum values between 0.5 A, the UCC27710 peak source current, and the calculated value based on the gate drive loop resistance.
In this example:
Equation 9.
Equation 10.
Therefore, the high-side and low side peak source current is ~0.5 A. Similarly, the peak sink current can be calculated with:
Equation 11.
Equation 12.
where
- ROFF: External turn-off resistance
- VDGATE: The diode forward voltage drop which is in series with ROFF. The diode in this example is an MBRM130L.
- IO- = Peak sink current. The maximum values between 1.0 A, the UCC27710 peak sink current, and the calculated value based on the gate drive loop resistance.
In this example:
Equation 13.
Equation 14.