ZHCSGE8A
June 2017 – August 2018
UCC27712
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
典型传播延迟比较
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Dynamic Electrical Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
VDD and Under Voltage Lockout
7.3.2
Input and Output Logic Table
7.3.3
Input Stage
7.3.4
Output Stage
7.3.5
Level Shift
7.3.6
Low Propagation Delays and Tightly Matched Outputs
7.3.7
Parasitic Diode Structure
7.4
Device Functional Modes
7.4.1
Minimum Input Pulse Operation
7.4.2
Output Interlock and Dead Time
7.4.3
Operation Under 100% Duty Cycle Condition
7.4.4
Operation Under Negative HS Voltage Condition
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Selecting HI and LI Low Pass Filter Components (RHI, RLI, CHI, CLI)
8.2.2.2
Selecting Bootstrap Capacitor (CBOOT)
8.2.2.3
Selecting VDD Bypass/Holdup Capacitor (CVDD) and Rbias
8.2.2.4
Selecting Bootstrap Resistor (RBOOT)
8.2.2.5
Selecting Gate Resistor RON/ROFF
8.2.2.6
Selecting Bootstrap Diode
8.2.2.7
Estimate the UCC27712 Power Losses (PUCC27712)
8.2.2.8
Estimating Junction Temperature
8.2.2.9
Operation With IGBT's
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
文档支持
11.1.1
相关文档
11.2
相关链接
11.3
社区资源
11.4
商标
11.5
静电放电警告
11.6
术语表
12
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
D|8
MSOI002K
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsge8a_oa
6.7
Typical Characteristics
Figure 2.
Low-Side, Turn-On Propagation Delay vs Temperature
Figure 4.
High-Side, Turn-On Propagation Delay vs Temperature
Figure 6.
Turn-On Delay Matching vs Temperature
Figure 8.
High-Side Propagation Delay vs HS
Figure 10.
LO Fall Time with 1000-pF Load vs Temperature
Figure 12.
HO Fall Time with 1000-pF Load vs Temperature
Figure 14.
VHB-VHS UVLO Thresholds vs Temperature
Figure 16.
HI/LI Pin High Threshold vs Temperature
Figure 18.
HI/LI Pin Hysteresis vs Temperature
Figure 20.
HO Output Pull-Down Resistance vs Temperature
Figure 22.
HO Output Pull-Up Resistance vs Temperature
Figure 24.
Quiescent HB to HS Supply Current vs Temperature
Figure 26.
VDD and HB Operating Current with No Load vs Switching Frequency
Figure 28.
VDD and HB Operating Current with 4700-pF Load vs Switching Frequency
Figure 3.
Low-Side, Turn-Off Propagation Delay vs Temperature
Figure 5.
High-Side, Turn-Off Propagation Delay vs Temperature
Figure 7.
Turn-Off Delay Matching vs Temperature
Figure 9.
LO Rise Time with 1000-pF Load vs Temperature
Figure 11.
HO Rise Time with 1000-pF Load vs Temperature
Figure 13.
VDD UVLO Thresholds vs Temperature
Figure 15.
VDD and VHB-VHS UVLO Hysteresis vs Temperature
Figure 17.
HI/LI Pin Low Threshold vs Temperature
Figure 19.
LO Output Pull-Down Resistance vs Temperature
Figure 21.
LO Output Pull-Up Resistance vs Temperature
Figure 23.
Total Quiescent VDD plus HB Supply Current vs Temperature
Figure 25.
HB to COM Bootstrap Supply Leakage Current vs Temperature
Figure 27.
VDD and HB Operating Current with 1000-pF Load vs Switching Frequency
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