ZHCSD93A january   2015  – december 2020 UCC28700-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-6657BD5B-29CE-4F76-A6A3-BA4B57482A18/SLUSB418335
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Detailed Pin Description
        1. 7.3.1.1 VDD (Device Bias Voltage Supply)
        2. 7.3.1.2 GND (Ground)
        3. 7.3.1.3 VS (Voltage-Sense)
        4. 7.3.1.4 DRV (Gate Drive)
        5. 7.3.1.5 CS (Current Sense)
        6. 7.3.1.6 CBC (Cable Compensation)
      2. 7.3.2 Fault Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Primary-Side Voltage Regulation
      2. 7.4.2 Primary-Side Current Regulation
      3. 7.4.3 Valley-Switching
      4. 7.4.4 Start-Up Operation
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Transformer Parameter Verification
        2. 8.2.2.2 Output Capacitance
        3. 8.2.2.3 VDD Capacitance, CDD
        4. 8.2.2.4 VDD Start-Up Resistance, RSTR
        5. 8.2.2.5 VS Resistor Divider, Line Compensation, and Cable Compensation
        6. 8.2.2.6 Input Bulk Capacitance and Minimum Bulk Voltage
        7. 8.2.2.7 Transformer Turns Ratio, Inductance, Primary-Peak Current
        8. 8.2.2.8 Standby Power Estimate
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1  Capacitance Terms in Farads
        2. 11.1.1.2  Duty Cycle Terms
        3. 11.1.1.3  Frequency Terms in Hertz
        4. 11.1.1.4  Current Terms in Amperes
        5. 11.1.1.5  Current and Voltage Scaling Terms
        6. 11.1.1.6  Transformer Terms
        7. 11.1.1.7  Power Terms in Watts
        8. 11.1.1.8  Resistance Terms in Ω
        9. 11.1.1.9  Timing Terms in Seconds
        10. 11.1.1.10 Voltage Terms in Volts
        11. 11.1.1.11 AC Voltage Terms in VRMS
        12. 11.1.1.12 Efficiency Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
  13.   Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)UCC28700-Q1UNIT
DBV
6 PINS
θJAJunction-to-ambient thermal resistance(2)180°C/W
θJCtopJunction-to-case (top) thermal resistance(3)71.2
θJBJunction-to-board thermal resistance(4)44.4
ψJTJunction-to-top characterization parameter(5)5.1
ψJBJunction-to-board characterization parameter(6)43.8
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RθJA, using a procedure described in JESD51-2a (sections 6 and 7).
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