SLUSBE8B May   2013  – September 2015 UCC28720

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Detailed Pin Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Primary-Side Voltage Regulation
      2. 7.4.2 Primary-Side Current Regulation
      3. 7.4.3 Valley Switching
      4. 7.4.4 Start-Up Operation
      5. 7.4.5 Fault Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Stand-by Power Estimate
        2. 8.2.2.2 Input Bulk Capacitance and Minimum Bulk Voltage
        3. 8.2.2.3 Transformer Turns Ratio, Inductance, Primary-Peak Current
        4. 8.2.2.4 Transformer Parameter Verification
        5. 8.2.2.5 Output Capacitance
        6. 8.2.2.6 VDD Capacitance, CDD
        7. 8.2.2.7 VS Resistor Divider, Line Compensation, and Cable Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 Definition of Terms
          1. 11.1.1.1.1  Capacitance Terms in Farads
          2. 11.1.1.1.2  Duty Cycle Terms
          3. 11.1.1.1.3  Frequency Terms in Hertz
          4. 11.1.1.1.4  Current Terms in Amperes
          5. 11.1.1.1.5  Current and Voltage Scaling Terms
          6. 11.1.1.1.6  Transformer Terms
          7. 11.1.1.1.7  Power Terms in Watts
          8. 11.1.1.1.8  Resistance Terms in Ω
          9. 11.1.1.1.9  Timing Terms in Seconds
          10. 11.1.1.1.10 Voltage Terms in Volts
          11. 11.1.1.1.11 AC Voltage Terms in VRMS
          12. 11.1.1.1.12 Efficiency Terms
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
VHV Start-up pin voltage, HV 700 V
VVDD Bias supply voltage, VDD 38 V
IDRV Continuous base current sink 50 mA
IDRV Continuous base current source Self- limiting mA
IVS Peak current, VS −1.2 mA
VDRV Base drive voltage at DRV −0.5 Self- limiting V
VS Voltage −0.75 7 V
CS, CBC −0.5 5 V
TJ Operating junction temperature −55 150 °C
Lead temperature 0.6 mm from case for 10 seconds 260 °C
TSTG Storage temperature −65 150 °C
(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. These ratings apply over the operating ambient temperature ranges unless otherwise noted.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Bias supply operating voltage 9 35 V
CVDD VDD bypass capacitor 1.0 10 µF
RCBC Cable-compensation resistance 10 kΩ
IVS VS pin current −1 mA
TJ Operating junction temperature −40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) UCC28720 UNIT
D (SOIC)
7 PIN
RθJA Junction-to-ambient thermal resistance 141.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 73.8 °C/W
RθJB Junction-to-board thermal resistance 89.0 °C/W
ψJT Junction-to-top characterization parameter 23.5 °C/W
ψJB Junction-to-board characterization parameter 88.2 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range, VVDD = 25 V, HV = open, RCBC = open, TA = –40°C to 125°C, TA = TJ
(unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
HIGH-VOLTAGE START UP
IHV Start-up current out of VDD VHV = 100 V, VVDD = 0 V, start state 100 225 500 µA
IHVLKG Leakage current at HV VHV = 400 V, run state, TJ = 25 ºC 0.01 0.25 µA
BIAS SUPPLY INPUT
IRUN Supply current, run IDRV = 0, run state 2.00 2.65 mA
IWAIT Supply current, wait IDRV = 0, wait state 95 150 µA
ISTART Supply current, start IDRV = 0, VVDD = 18 V, start state, IHV = 0 18 30 µA
IFAULT Supply current, fault IDRV = 0, fault state 95 150 µA
UNDERVOLTAGE LOCKOUT
VVDD(on) VDD turn-on threshold VVDD low to high 19 21 23 V
VVDD(off) VDD turn-off threshold VVDD high to low 7.35 7.7 8.15 V
VS INPUT
VVSR Regulating level Measured at no-load condition, TJ = 25°C(1) 4.01 4.05 4.09 V
V
VVSNC Negative clamp level IVS = -300 µA, volts below ground 190 250 325 mV
IVSB Input bias current VVS = 4 V -0.25 0 0.25 µA
CS INPUT
VCST(max) Max CS threshold voltage VVS = 3.7 V 735 780 815 mV
VCST(min) Min CS threshold voltage VVS = 4.35 V 175 190 215 mV
KAM AM control ratio VCST(max) / VCST(min) 3.6 4.0 4.4 V/V
VCCR Constant current regulating level CC regulation constant 317 330 344 mV
KLC Line compensation current ratio IVSLS = -300 µA, IVSLS / current out of CS pin 24.0 25.0 28.6 A/A
TCSLEB Leading-edge blanking time DRV output duration, V CS = 1 V 230 290 355 ns
DRIVER
IDRS(max) Maximum DRV source current VDRV = 2 V, VVDD = 9 V, VVS = 3.85 V 32 37 41 mA
IDRS(min) Minimum DRV source current VDRV = 2 V, VVDD = 9 V, VVS = 4.30 V 16 19 22 mA
RDRVLS DRV low-side drive resistance IDRV = 10 mA 1 2.4 Ω
VDRCL DRV clamp voltage VVDD = 35 V 5.9 7 V
RDRVSS DRV pull-down in start state 20 25 kΩ
VOVP Over-voltage threshold At VS input, TJ = 25°C(1) 4.51 4.60 4.73 V
V
VOCP Over-current threshold At CS input 1.4 1.5 1.6 V
IVSL(run) VS line-sense run current Current out of VS pin increasing 190 225 275 µA
IVSL(stop) VS line-sense stop current Current out of VS pin decreasing 70 80 100 µA
KVSL VS line sense ratio IVSL(run) / IVSL(stop) 2.45 2.80 3.05 A/A
TJ(stop) Thermal shut-down temperature Internal junction temperature 165 °C
CABLE COMPENSATION
VCBC(max) Cable compensation maximum voltage Voltage at CBC at full load 2.9 3.1 3.5 V
VCVS(min) Minimum compensation at VS VCBC = open, change in VS regulating level at full load -55 -15 25 mV
VCVS(max) Maximum compensation at VS VCBC = 0 V, change in VS regulating level at full load 275 320 380 mV
(1) The regulating level and over voltage at VS decreases with temperature by 0.8 mV/˚C. This compensation is included to reduce the power supply output voltage variance over temperature.

Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fSW(max) + Maximum switching frequency VVS = 3.7 V 74 80 87 kHz
fSW(min) Minimum switching frequency VVS = 4.35 V 580 650 740 Hz
tZTO Zero-crossing timeout delay 2.5 3.1 3.6 µs

6.6 Typical Characteristics

VDD = 25 V, unless otherwise noted.
UCC28720 C001_SLUSBE8.png Figure 1. Bias Supply Current vs. VDD Voltage
UCC28720 C003_SLUSBE8.png Figure 3. VS Pin Regulation Voltage vs. Junction Temperature
UCC28720 C005_SLUSBE8.png Figure 5. Current Sense Threshold vs. Temperature
UCC28720 C007_SLUSBE8.png Figure 7. Minimum Switching Frequency vs. Junction Temperature
UCC28720 C008_SLUSBE8.png Figure 9. Driver Output Source Current vs. Junction Temperature
UCC28720 C010_SLUSBE8.png Figure 11. Over Voltage Protection Threshold vs. Junction Temperature
UCC28720 C002_SLUSBE8.png Figure 2. Operating Current vs. Junction Temperature
UCC28720 C004_SLUSBE8.png Figure 4. VS Pin Start and Stop Thresholds vs. Junction Temperature
UCC28720 C006_SLUSBE8.png Figure 6. Constant Current Regulation Level vs. Junction Temperature
UCC28720 C012_SLUSBE8.png Figure 8. Maximum Switching Frequency vs. Junction Temperature
UCC28720 C009_SLUSBE8.png Figure 10. Driver Pull Down Resistance vs. Junction Temperature
UCC28720 C011_SLUSBE8.png Figure 12. HV Charging Current vs. Junction Temperature
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