13.1 Layout Guidelines
In order to increase the reliability and feasibility of the project it is recommended to follow the here below guidelines.
- Place the RIPK resistance as close as possible to the device with the shortest available traces.
- Try to minimize the area of DRAIN trace, this helps in keeping EMI disturbance low.
- A copper area connected to the GND pins improves heat sinking thermal performance.
- A copper area connected to anode and cathode secondary diode improves heat sinking with an emphasis on the quiet area of the diode, the diode connected to the output capacitor, this limits the EMI disturbance.
- Place the auxiliary voltage sense resistor divider (RS1 and RS2 in Figure 52) directly on the VS pin keeping traces as short as possible.