SLUS829G August   2008  – February 2020 UCC2897A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Diagram
  4. Revision History
  5. Device Options
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Detailed Pin Descriptions
        1. 8.3.1.1  RDEL
        2. 8.3.1.2  RON
        3. 8.3.1.3  ROFF
        4. 8.3.1.4  VREF
        5. 8.3.1.5  SYNC
        6. 8.3.1.6  GND
        7. 8.3.1.7  CS
        8. 8.3.1.8  RSLOPE
        9. 8.3.1.9  FB
        10. 8.3.1.10 SS/SD
        11. 8.3.1.11 PGND
        12. 8.3.1.12 AUX
        13. 8.3.1.13 OUT
        14. 8.3.1.14 VDD
        15. 8.3.1.15 LINEUV
        16. 8.3.1.16 VIN
        17. 8.3.1.17 LINEOV
      2. 8.3.2 JFET Control and UVLO
      3. 8.3.3 Line Undervoltage Protection
      4. 8.3.4 Line Overvoltage Protection
      5. 8.3.5 Pulse Skipping
      6. 8.3.6 Synchronization
      7. 8.3.7 Gate Drive Connection
      8. 8.3.8 Bootstrap Biasing
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Oscillator
        2. 9.2.2.2 Soft Start
        3. 9.2.2.3 VDD Bypass Requirements
        4. 9.2.2.4 Delay Programming
        5. 9.2.2.5 Input Voltage Monitoring
        6. 9.2.2.6 Current Sense and Slope Compensation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

Layout Guidelines

  • Connection of Two Grounds: GND (analog ground) and PGND (power ground). Two grounds should be connected using a net tie right between GND pin and PGND pin at IC, and there should be only this connection between two grounds.
  • The bypass capacitors to the VDD pin and VREF pin should be as close as possible to the device GND.
  • The timing configuration pins RDEL, RTON, RTOFF, and RSLOPE are connected to the device GND as close as possible.
  • PGND should serve as the current return for the high current output drivers OUT and AUX. The current path should be as short as possible.
  • Connect PVDD and VDD using a 0ohm resistor right at IC of these two pins.