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ZHCSU66J August 2001 – December 2023 UCC29002 , UCC39002

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		UCC29002, UCC29002-1, UCC39002			UNIT
		D (SOIC)	DGK (VSSOP)	P (PDIP)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	111.9	168.0	54.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	58.6	61.9	43.9	°C/W
R_θJB	Junction-to-board thermal resistance	52.6	88.8	31.2	°C/W
ψ_JT	Junction-to-top characterization parameter	12.9	7.3	21.6	°C/W
ψ_JB	Junction-to-board characterization parameter	52.0	87.2	31.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.