ZHCSIP1F April 1999 – July 2018 UCC2808A-1 , UCC2808A-2 , UCC3808A-1 , UCC3808A-2
PRODUCTION DATA.
| THERMAL METRIC(1) | UCCx808A | UCC2808A-x
UCC3808A-2 |
UNIT | ||
|---|---|---|---|---|---|
| D (SOIC) | P (PDIP) | PW (TSSOP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 105.4 | 57 | 151.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 47.9 | 49.6 | 36.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.5 | 34.3 | 81.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.7 | 19.5 | 1.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.9 | 34.2 | 79.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | °C/W |