The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal characteristics of the package. In order for a gate driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The thermal metrics for the driver package is summarized in Section 6.4 of the data sheet. For detailed information regarding the thermal information table, refer to the Application Note from Texas Instruments entitled IC Package Thermal Metrics (SPRA953).

The UCC44273 is offered in SOT-23, 5-pin package (DBV). The Section 6.4 table summarizes the thermal performance metrics related to the package. θ_JA metric should be used for comparison of power dissipation between different packages. The ψ_JT and ψ_JB metrics should be used when estimating the die temperature during actual application measurements.

The DBV package heat removal occurs primarily through the leads of the device and the PCB traces connected to the leads.