over operating free-air temperature range (unless otherwise noted)(1)(2)(3) | MIN | MAX | UNIT |
|---|
| Supply voltage | VDD | –0.3 | 20 | V |
| OUT voltage | DC | –0.3 | VDD + 0.3 | V |
| Repetitive pulse less than 200 ns(5) | –2 | VDD + 0.3 |
| Output continuous current | IOUT_DC (source/sink) | | 0.3 | A |
| Output pulsed current (0.5 µs) | IOUT_pulsed(source/sink) | | 4 | |
| Input voltage | IN(4) | –6 | 20 | V |
| Operating virtual junction temperature, TJ | –40 | 150 | °C |
| Lead temperature | Soldering, 10 sec. | | 300 | °C |
| Reflow | | 260 |
| Storage temperature, Tstg | –65 | 150 | °C |
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device-handling procedures.
(4) Maximum voltage on input pins is not restricted by the voltage on the VDD pin.
(5) Values are verified by characterization on bench.