A large amount of power may be dissipated by the UCC5304 if the driving voltage is high, the load is heavy, or the switching frequency is high (Refer to for more details). Proper PCB layout can help dissipate heat from the device to the PCB and minimize junction to board thermal impedance (θJB).
Increasing the PCB copper connecting to VDD and VSS pins is recommended, with priority on maximizing the connection to VSS (See and ). However, high voltage PCB considerations mentioned above must be maintained.
If there are multiple layers in the system, it is also recommended to connect the VDD and VSS pins to internal ground or power planes through multiple vias of adequate size. Ensure that no traces or coppers from different high-voltage planes overlap.