SLUSFL3B June 2024 – October 2024 UCC57102 , UCC57108
PRODUCTION DATA
THERMAL METRIC(1) | THERMAL METRIC(1) | UCC5710X | UNIT |
---|---|---|---|
D | |||
8PINS | |||
RθJA | Junction-to-ambient thermal resistance | 132.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 74.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 76.3 | °C/W |
ΨJT | Junction-to-top characterization parameter | 25.6 | °C/W |
ΨJB | Junction-to-board characterization parameter | 75.4 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |