ZHCSV13A December 2023 – March 2024 UCC57108-Q1
ADVMIX
THERMAL METRIC(1) | UCC5710x-Q1 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 126.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 67.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 69.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 19.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 69.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |