ZHCSRA0 December   2022 UCC5871-Q1

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  SPI Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Component Placement
      2. 7.1.2 Grounding Considerations
      3. 7.1.3 High-Voltage Considerations
      4. 7.1.4 Thermal Considerations
    2. 7.2 Layout Example
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 术语表
  9. 9Mechanical, Packaging, and Orderable Information

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Grounding Considerations

  • It is essential to confine the high peak currents that charge and discharge the transistor gates to a minimal physical area. This decreases the loop inductance and minimize noise on the gate terminals of the transistors. The gate driver must be placed as close as possible to the transistors.
  • Pay attention to high current path that includes the bootstrap capacitor. The bootstrap capacitor is recharged on a cycle-by-cycle basis through the diode by the VCC2 bypass capacitor. This recharging occurs in a short time interval and involves a high peak current. Minimizing this loop length and area on the circuit board is important for ensuring reliable operation.