SLUSC99A July   2016  – January 2017 UCD3138128A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 PMBus/SMBus/I2C Timing
    8. 7.8 Typical Characteristics
    9. 7.9 Timing Diagrams
  8. 8 Parametric Measurement Information
    1. 8.1 Typical Clock Gating Power Savings
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 ARM Processor
      2. 9.1.2 Memory
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  System Module
        1. 9.3.1.1 Address Decoder (DEC)
        2. 9.3.1.2 Memory Management Controller (MMC)
        3. 9.3.1.3 System Management (SYS)
        4. 9.3.1.4 Central Interrupt Module (CIM)
      2. 9.3.2  Peripherals
        1. 9.3.2.1 Digital Power Peripherals (DPPs)
          1. 9.3.2.1.1 Front End
          2. 9.3.2.1.2 DPWM Module
          3. 9.3.2.1.3 DPWM Events
          4. 9.3.2.1.4 High Resolution DPWM
          5. 9.3.2.1.5 Oversampling
          6. 9.3.2.1.6 DPWM Interrupt Generation
          7. 9.3.2.1.7 DPWM Interrupt Scaling/Range
          8. 9.3.2.1.8 Synchronous Rectifier Dead Time Optimization Peripheral
      3. 9.3.3  Automatic Mode Switching
        1. 9.3.3.1 Phase Shifted Full Bridge Example
        2. 9.3.3.2 LLC Example
        3. 9.3.3.3 Mechanism For Automatic Mode Switching
      4. 9.3.4  DPWMC, Edge Generation, Intramux
      5. 9.3.5  Synchronous Rectifier MOSFET Ramp And IDE Calculation
      6. 9.3.6  Filter
        1. 9.3.6.1 Loop Multiplexer
        2. 9.3.6.2 Fault Multiplexer
      7. 9.3.7  Communication Ports
        1. 9.3.7.1 SCI (UART) Serial Communication Interface
        2. 9.3.7.2 PMBUS/I2C
          1. 9.3.7.2.1 Example: PMBus Address Decode via ADC12 Reading
        3. 9.3.7.3 SPI
        4. 9.3.7.4 JTAG Standard Interface
      8. 9.3.8  Real Time Clock
      9. 9.3.9  External Crystal Interface
      10. 9.3.10 Timers
        1. 9.3.10.1 24-Bit Timer
        2. 9.3.10.2 16-Bit PWM Timers
        3. 9.3.10.3 Watchdog Timer
      11. 9.3.11 General Purpose ADC12
      12. 9.3.12 Miscellaneous Analog
      13. 9.3.13 Brownout
      14. 9.3.14 Global I/O
      15. 9.3.15 Temperature Sensor Control
      16. 9.3.16 I/O Mux Control
      17. 9.3.17 Current Sharing Control
      18. 9.3.18 Temperature Reference
    4. 9.4 Device Functional Modes
      1. 9.4.1 DPWM Modes of Operation
        1. 9.4.1.1 Normal Mode
        2. 9.4.1.2 DPWM Multiple Output Mode
        3. 9.4.1.3 DPWM Resonant Mode
        4. 9.4.1.4 Triangular Mode
        5. 9.4.1.5 Leading Edge Mode
        6. 9.4.1.6 Phase Shifting
    5. 9.5 Register Maps
      1. 9.5.1 CPU Memory Map And Interrupts
        1. 9.5.1.1 Memory Map (After Reset Operation)
        2. 9.5.1.2 Memory Map (Normal Operation)
        3. 9.5.1.3 Memory Map (System And Peripherals Blocks)
      2. 9.5.2 Boot ROM
        1. 9.5.2.1 Pseudo Code for ROM
      3. 9.5.3 Customer Boot Program
      4. 9.5.4 Flash Management
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration Overview
        2. 10.2.2.2 DPWM Initialization for PSFB
        3. 10.2.2.3 DPWM Synchronization
        4. 10.2.2.4 Fixed Signals to Bridge
        5. 10.2.2.5 Dynamic Signals to Bridge
      3. 10.2.3 System Initialization for PCM
        1. 10.2.3.1 Use of Front Ends and Filters in PSFB
        2. 10.2.3.2 Peak Current Detection
        3. 10.2.3.3 Peak Current Mode (PCM)
      4. 10.2.4 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Device Grounding and Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
        1. 13.2.1.1 References
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Power Supply Recommendations

  • Both 3.3 VD and 3.3 VA should have a local capacitor of at least 4.7-µF in parallel with a 10-nF capacitor placed as close as possible to the device pins.
  • BP18 should have a 1-µF capacitor in parallel with a 10-nF capacitor to ground.

For detailed practical design guidelines, refer to (SLUA779).
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