ZHCSFJ6B August   2016  – March 2022 UCD9090A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C/Smbus/PMBus Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TI Fusion GUI
      2. 7.3.2 PMBus Interface
      3. 7.3.3 Rail Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Supply Sequencing
        1. 7.4.1.1 Turn-On Sequencing
        2. 7.4.1.2 Turn-Off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Monitoring
        1. 7.4.3.1 Voltage Monitoring
        2. 7.4.3.2 Current Monitoring
        3. 7.4.3.3 Remote Temperature Monitoring and Internal Temperature Sensor
        4. 7.4.3.4 Temperature by Host Input
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
        1. 7.4.9.1 Fault Shutdown Rails
        2. 7.4.9.2 Configured as Sequencing Debug Pin
        3. 7.4.9.3 Configured as Fault Pin
        4. 7.4.9.4 Cold Boot Mode Enable
      10. 7.4.10 Power Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-2
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 Run Time Clock
      16. 7.4.16 System Reset Signal
      17. 7.4.17 Watch Dog Timer
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
      21. 7.4.21 Device Reset
      22. 7.4.22 JTAG Interface
      23. 7.4.23 Internal Fault Management and Memory Error Correction (ECC)
    5. 7.5 Programming
      1. 7.5.1 Full Configuration Update While in Normal Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Estimating ADC Reporting Accuracy
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)UCD9090AUNIT
RGZ (VQFN)
48 PINS
RθJAJunction-to-ambient thermal resistance25°C/W
RθJC(top)Junction-to-case (top) thermal resistance8.9°C/W
RθJBJunction-to-board thermal resistance5.5°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter1.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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