ZHCSC42J July   2013  – October 2014 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Description
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  External Digital Slow Clock Requirements
    6. 5.6  Thermal Characteristics
    7. 5.7  WLAN Performance
      1. 5.7.1 WLAN 2.4-GHz Receiver Characteristics
      2. 5.7.2 WLAN 2.4-GHz Transmitter Power
      3. 5.7.3 WLAN Currents
    8. 5.8  Bluetooth Performance
      1. 5.8.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
      2. 5.8.2 Bluetooth Transmitter, BR
      3. 5.8.3 Bluetooth Transmitter, EDR
      4. 5.8.4 Bluetooth Modulation, BR
      5. 5.8.5 Bluetooth Modulation, EDR
    9. 5.9  Bluetooth LE Performance
      1. 5.9.1 Bluetooth LE Receiver Characteristics - In-Band Signals
      2. 5.9.2 Bluetooth LE Transmitter Characteristics
      3. 5.9.3 Bluetooth LE Modulation Characteristics
    10. 5.10 Bluetooth-BLE Dynamic Currents
    11. 5.11 Bluetooth LE Currents
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power Management
        1. 5.12.1.1 Block Diagram - Internal DC2DCs
      2. 5.12.2 Power-Up and Shut-Down States
      3. 5.12.3 Chip Top-level Power-Up Sequence
      4. 5.12.4 WLAN Power-Up Sequence
      5. 5.12.5 Bluetooth-BLE Power-Up Sequence
      6. 5.12.6 WLAN SDIO Transport Layer
        1. 5.12.6.1 SDIO Timing Specifications
        2. 5.12.6.2 SDIO Switching Characteristics - High Rate
      7. 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.12.7.1 UART 4-Wire Interface - H4
      8. 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN
    2. 6.2 Bluetooth
    3. 6.3 BLE
    4. 6.4 WiLink 8 Module Markings
    5. 6.5 Test Grades
  7. 7Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1835MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 社区资源
    4. 8.4 商标
    5. 8.5 静电放电警告
    6. 8.6 术语表
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOC|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Detailed Description

The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology.

Table 6-1 through Table 6-3 list performance parameters along with shutdown and sleep currents.

Table 6-1 WLAN Performance Parameters

WLAN(3) SPECIFICATION (TYP) CONDITIONS
Maximum TX power 17.3 dBm 1 Mbps DSSS
Minimum sensitivity –96.3 dBm 1 Mbps DSSS
Sleep current 160 µA Leakage, firmware retained
Connected IDLE 750 µA No traffic IDLE connect
RX search 54 mA Search (SISO20)
RX current (SISO20) 65 mA MCS7, 2.4 GHz
TX current (SISO20)(1) 238 mA MCS7, 2.4 GHz, +11.2 dBm
Maximum peak current consumption during calibration(2) 850 mA
(1) WLAN maximum VBAT current draw of 725 mA with MIMO continues burst configuration.
(2) Peak current VBAT can hit 850 mA during device calibration.
  • At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band.
  • Once a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned.
  • The maximum VBAT value is based on peak calibration consumption with a 30% margin.
(3) System design power scheme must comply with both peak and average TX bursts.

Table 6-2 Bluetooth Performance Parameters

BLUETOOTH SPECIFICATION (TYP) CONDITIONS
Maximum TX power 12.7 dBm GFSK
Minimum sensitivity –92.2 dBm GFSK
Sniff 178 µA 1 attempt, 1.28 s (+4 dBm)
Page or inquiry 253 µA 1.28-s interrupt, 11.25-ms scan window (+4 dBm)
A2DP 7.5 mA MP3 high quality 192 kbps (+4 dBm)

Table 6-3 Shutdown and Sleep Currents

PARAMETER POWER SUPPLY CURRENT TYP UNIT
Shutdown mode
All functions shut down		 VBAT 10 µA
VIO 2 µA
WLAN sleep mode VBAT 160 µA
Bluetooth sleep mode VBAT 110 µA

Figure 6-1 shows a high-level view of the WL1835MOD variant.

SWRS152-01.gifFigure 6-1 WL1835MOD High-Level System Diagram

6.1 WLAN

The device supports the following WLAN features:

  • Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution
  • Baseband processor: IEEE Std 802.11b/g and IEEE Std 802.11n data rates with 20- or 40-MHz SISO and 20-MHz MIMO
  • Fully calibrated system (production calibration not required)
  • Medium access controller (MAC)
    • Embedded ARM® central processing unit (CPU)
    • Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
    • Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes hardware-accelerated Advanced Encryption Standard [AES])
  • New advanced coexistence scheme with Bluetooth and BLE
  • 2.4-GHz radio
    • Internal LNA and PA
    • IEEE Std 802.11b, 802.11g, and 802.11n
  • 4-bit SDIO host interface, including high speed (HS) and V3 modes

6.2 Bluetooth

The device supports the following Bluetooth features:

  • Bluetooth 4.0 as well as CSA2
  • Concurrent operation and built-in coexisting and prioritization handling of Bluetooth, BLE, audio processing, and WLAN
  • Dedicated audio processor supporting on-chip SBC encoding + A2DP
    • Assisted A2DP (A3DP): SBC encoding implemented internally
    • Assisted WB-speech (AWBS): modified SBC codec implemented internally

6.3 BLE

The device supports the following BLE features:

  • Bluetooth 4.0 BLE dual-mode standard
  • All roles and role combinations, mandatory as well as optional
  • Up to 10 BLE connections
  • Independent LE buffering allowing many multiple connections with no affect on BR-EDR performance

6.4 WiLink 8 Module Markings

Figure 6-2 shows the markings for the TI WiLink 8 module.

SWRS152-23A.gifFigure 6-2 WiLink 8 Module Markings

Table 6-4 describes the WiLink 8 module markings.

Table 6-4 Description of WiLink 8 Module Markings

MARKING DESCRIPTION
WL18 MODGB Model
&& Test grade (for more information, see Section 6.5, Test Grades)
Z64-WL18SBMOD FCC ID: single modular FCC grant ID
451I-WL18SBMOD IC: single modular IC grant ID
YYWWSSF LTC (lot trace code):
  • YY = year (for example, 12 = 2012)
  • WW = week
  • SS = serial number (01 to 99) matching manufacturer lot number
  • F = Reserved for internal use
201-135370 R: single modular TELEC grant ID
telec_logo_swrs152.gif TELEC compliance mark
CE CE compliance mark

6.5 Test Grades

To minimize delivery time, TI may ship the device ordered or an equivalent device currently available that contains at least the functions of the part ordered. From all aspects, this device will behave exactly the same as the part ordered. For example, if a customer orders device WL1801MOD, the part shipped can be marked with a test grade of 37, 07 (see Table 6-5).

Table 6-5 Test Grade Markings

MARK 1 WLAN BLUETOOTH
0& Tested –
3& Tested Tested
MARK 2 WLAN 2.4 GHz MIMO 2.4 GHz
&1 Tested –
&5 Tested Tested
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