ZHCSC42J July   2013  – October 2014 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Description
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  External Digital Slow Clock Requirements
    6. 5.6  Thermal Characteristics
    7. 5.7  WLAN Performance
      1. 5.7.1 WLAN 2.4-GHz Receiver Characteristics
      2. 5.7.2 WLAN 2.4-GHz Transmitter Power
      3. 5.7.3 WLAN Currents
    8. 5.8  Bluetooth Performance
      1. 5.8.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
      2. 5.8.2 Bluetooth Transmitter, BR
      3. 5.8.3 Bluetooth Transmitter, EDR
      4. 5.8.4 Bluetooth Modulation, BR
      5. 5.8.5 Bluetooth Modulation, EDR
    9. 5.9  Bluetooth LE Performance
      1. 5.9.1 Bluetooth LE Receiver Characteristics - In-Band Signals
      2. 5.9.2 Bluetooth LE Transmitter Characteristics
      3. 5.9.3 Bluetooth LE Modulation Characteristics
    10. 5.10 Bluetooth-BLE Dynamic Currents
    11. 5.11 Bluetooth LE Currents
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power Management
        1. 5.12.1.1 Block Diagram - Internal DC2DCs
      2. 5.12.2 Power-Up and Shut-Down States
      3. 5.12.3 Chip Top-level Power-Up Sequence
      4. 5.12.4 WLAN Power-Up Sequence
      5. 5.12.5 Bluetooth-BLE Power-Up Sequence
      6. 5.12.6 WLAN SDIO Transport Layer
        1. 5.12.6.1 SDIO Timing Specifications
        2. 5.12.6.2 SDIO Switching Characteristics - High Rate
      7. 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.12.7.1 UART 4-Wire Interface - H4
      8. 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN
    2. 6.2 Bluetooth
    3. 6.3 BLE
    4. 6.4 WiLink 8 Module Markings
    5. 6.5 Test Grades
  7. 7Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1835MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 社区资源
    4. 8.4 商标
    5. 8.5 静电放电警告
    6. 8.6 术语表
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOC|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support

For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

8.1.2 Device Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices.

X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: “This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device.
null Device is qualified and released to production. TI’s standard warranty applies to production devices.

8.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
WL1801MOD Click here Click here Click here Click here Click here
WL1805MOD Click here Click here Click here Click here Click here
WL1831MOD Click here Click here Click here Click here Click here
WL1835MOD Click here Click here Click here Click here Click here

8.3 社区资源

下列链接提供到 TI 社区资源的连接。 链接的内容由各个分销商“按照原样”提供。 这些内容并不构成 TI 技术规范和标准且不一定反映 TI 的观点；请见 TI 的使用条款。

    TI E2E™ 在线社区 TI 工程师对工程师 (E2E) 社区。 此社区的创建目的是为了促进工程师之间协作。 在 e2e.ti.com 中，您可以咨询问题、共享知识、探索思路，在同领域工程师的帮助下解决问题。
    米6体育平台手机版_好二三四 (TI) 嵌入式处理器维基网站 米6体育平台手机版_好二三四 (TI) 嵌入式处理器维基网站。 此网站的建立是为了帮助开发人员从米6体育平台手机版_好二三四 (TI) 的嵌入式处理器入门并且也为了促进与这些器件相关的硬件和软件的总体知识的创新和增长。

8.4 商标

E2E is a trademark of Texas Instruments.

ARM is a registered trademark of ARM Physical IP, Inc.

Android is a trademark of Google Inc.

IEEE Std 802.11 is a trademark of IEEE.

Linux is a registered trademark of Linus Torvalds.

All other trademarks are the property of their respective owners.

8.5 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

8.6 术语表

SLYZ022 — TI 术语表。

这份术语表列出并解释术语、首字母缩略词和定义。
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