Solder the leadframe die pad to a thermal pad on the PCB. Figure 7-8 shows an example layout. Refinements to this layout can be required based on assembly process requirements. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heat-sink area on the printed circuit board (PCB).

Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability.