米6体育平台手机版

ZHCSHO6 February 2018 XTR305

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		XTR305	UNIT
		RGW (VQFN)
		20 PINS
R_θJA	Junction-to-ambient thermal resistance	32.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	25.1	°C/W
R_θJB	Junction-to-board thermal resistance	12.6	°C/W
ψ_JT	Junction-to-top characterization parameter	0.3	°C/W
ψ_JB	Junction-to-board characterization parameter	12.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	3.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.