ZHCSHO6 February   2018 XTR305

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output Mode
    6. 6.6  Electrical Characteristics: Current Output Mode
    7. 6.7  Electrical Characteristics: Operational Amplifier (OPA)
    8. 6.8  Electrical Characteristics: Instrumentation Amplifier (IA)
    9. 6.9  Electrical Characteristics: Current Monitor
    10. 6.10 Electrical Characteristics: Power and Digital
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Functional Features
      2. 7.3.2 Current Monitor
      3. 7.3.3 Error Flags
      4. 7.3.4 Power On/Off Glitch
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Voltage Output Mode
        2. 8.2.2.2  Current Output Mode
        3. 8.2.2.3  Input Signal Connection
        4. 8.2.2.4  Externally-Configured Mode: OPA and IA
        5. 8.2.2.5  Driver Output Disable
        6. 8.2.2.6  Driving Capacitive Loads and Loop Compensation
        7. 8.2.2.7  Internal Current Sources, Switching Noise, and Settling Time
        8. 8.2.2.8  IA Structure, Voltage Monitor
        9. 8.2.2.9  Digital I/O and Ground Considerations
        10. 8.2.2.10 Output Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 VQFN Package and Heat Sinking
    4. 10.4 Power Dissipation
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Electrical Characteristics: Current Output Mode

All specifications at TA = 25°C, VS = ±20 V, RLOAD = 800 Ω, RSET = 2 kΩ, ROS = 2 kΩ, VREF = 4 V, input signal span 0 V to 4 V, and CC = 100 pF, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage Output current < 1 μA ±0.4 ±2.5 mV
dVOS/dT Input offset voltage vs temperature ±1.5 ±10 μV/°C
PSRR Input offset voltage vs power supply VS = ±5 V to ±22 V ±0.2 ±10 μV/V
INPUT VOLTAGE RANGE
Nominal setup for ±20-mA output See Figure 36
Maximum input voltage for linear operation (V−) + 3 (V+) − 3 V
NOISE
Voltage noise, f = 0.1Hz to 10Hz, RTI 3 μVPP
en Voltage noise density, f = 1kHz, RTI 33 nV/√Hz
OUTPUT
Compliance voltage swing from rail IDRV = ±24 mA (V−) +3 (V+) − 3 V
Output conductance (dIDRV/dVDRV) dVDRV = ±15 V, dIDRV = ±24 mA 0.7 μA/V
Transconductance See transfer function in Figure 36
Gain error IDRV = ±24 mA ±0.04 ±0.2 %FS
Gain error vs temperature IDRV = ±24 mA ±3.6 ±10 ppm/°C
IB Linearity error IDRV = ±24 mA ±0.01 ±0.2 %FS
Linearity error vs temperature IDRV = ±24 mA ±1.5 ±10 ppm/°C
Output leakage current while output disabled OD pin = L 0.6 nA
ISC Short-circuit current ±24.5 ±32 ±38.5 mA
CLOAD Capacitive load drive(1)(2) 1 μF
FREQUENCY RESPONSE
Bandwidth −3 dB 160 kHz
SR Slew rate(2) 1.3 mA/μs
Settling time(2)(3), 0.1%, Small Signal IDRV = ±2 mA 8 μs
Overload recovery time CLOAD = 0, 50% overdrive 1 μs
(2) With capacitive load, the slew rate can be limited by the short circuit current and the load error flag can trigger during slewing.
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