1 Introduction

The Texas Instrument BUF634 high-speed-buffer device is available in four different package options, an 8-pin SOIC, 8-pin PDIP, 5-pin TO-220, and 5-pin TO-263. The newer version of the device, the BUF634A, is comparatively only available in three packages, an 8-pin SOIC, 8-pin VSON, and 8-pin HSOIC. Figure 1-1 shows examples of the different package footprints. From a thermal perspective, there may be some concern that the newer BUF634A does not include the TO-220 and TO-263 packages that feature large thermal connection areas. However, with proper design techniques, the VSON and HSOIC packages of the BUF634A can achieve similar thermal performance through their bottom-side thermal pad connections.