6 Test Set-Up and Procedures

SEE testing was performed on a TRF0206-SP device mounted on a EVM. The device was provided power through the VDD (3.3 V) and GND inputs using the N6702 precision power supply. The TRF0206-SP was evaluated with a DC input condition provided on the IN+ input. The INM pin is terminated on a 50-Ω termination in the EVM. The PD pin (J9) was connected to GND to keep the chip enabled.

The devices was evaluated in differential (DE) output modes. SETs where monitored using a DPO7254C Digital Phosphor Oscilloscope (4 ch, 2.5-GHz BW and 40-GS/s Sample Rate).

In SE mode, the outputs of the TRF0206-SP was monitored on the scope. In the DE mode, the outputs were monitored using a P6330 High Speed probe (BW > 3 GHz). The DPO was used to monitor the output voltage and capture any SET that exceed the limits set for the window trigger. The scope has a 3.2-µs update rate under the conditions used when collecting data (Fast-Frame mode). The update rate represents the amount of time to re-arm the scope trigger after an upset.

The power supply (PS) was controlled and monitored using a custom-develop LabView™ program (PXI-RadTest) running on a NI-PXIe-8135 controller. The DPO7254C was controlled using it front-panel interface. The DPO was left in the cave at all times, to minimize the probe cable length. A KVM extender was used to control and view the DPO from the control room at TAMU. A block diagram of the setup used for SEE testing the TRF0206-SP is shown in Figure 6-1. Equipment settings and compliances used during the characterization are provided in Table 6-1. For the SEL testing the device was heated using a convection heat gun aimed at the die. The junction temperature was monitored by using a K-type thermocouple attached as close as possible to the die.

All boards used for SEL testing were fully checked for functionality and dry runs performed to ensure that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabView™ control program powered up the TRF0206-SP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability had been confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters).

The SPDT connections shown in the block diagram was not physically present at any time, rather is used to represent the SE and DE connections using one block diagram.

Figure 6-1 Block Diagram of the Test Setup Used for the TRF0206-SP Mounted on an EVM