SBOK045 March   2024 INA901-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Single-Event Effects (SEE)
  6. 3Device and Test Board Information
  7. 4Irradiation Facility and Setup
  8. 5Test Setup and Procedures
  9. 6Destructive Single-Event Effects (DSEE)
    1. 6.1 Single-Event Latch-up (SEL) Results
  10. 7Single-Event Transients (SET)
  11. 8Event Rate Calculations
  12. 9Summary
  13.   A References

References

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  2. G. Bruguier and J. M. Palau, "Single particle-induced latchup", IEEE Trans. Nucl. Sci., Vol. 43(2), Mar. 1996, pp. 522-532.
  3. G. H. Johnson, J. H. Hohl, R. D. Schrimpf and K. F. Galloway, "Simulating single-event burnout of n-channel power MOSFET's," in IEEE Transactions on Electron Devices, vol. 40, no. 5, pp. 1001-1008, May 1993.
  4. J. R. Brews, M. Allenspach, R. D. Schrimpf, K. F. Galloway,J. L. Titus and C. F. Wheatley, "A conceptual model of a single-event gate-rupture in power MOSFETs," in IEEE Transactions on Nuclear Science, vol. 40, no. 6, pp. 1959-1966, Dec. 1993.
  5. G. H. Johnson, R. D. Schrimpf, K. F. Galloway, and R. Koga,“Temperature dependence of single event burnout in n-channel power MOSFETs [for space application],” IEEE Trans. Nucl. Sci., 39(6), Dec. 1992, pp.1605-1612.
  6. Texas A&M University, Cyclotron Institute, Texas A&M University Cyclotron Institute Radiation Effects Facility, webpage.
  7. Ziegler, James F, The Stopping and Range of Ions in Matter (SRIM) software simulation tool, webpage.
  8. D. Kececioglu, “Reliability and Life Testing Handbook”, Vol. 1, PTR Prentice Hall, New Jersey,1993, pp. 186-193.
  9. Vanderbilt University, ISDE CRÈME-MC, webpage.
  10. A. J. Tylka, J. H. Adams, P. R. Boberg, et al.,"CREME96: A Revision of the Cosmic Ray Effects on Micro-Electronics Code", IEEE Trans. on Nucl. Sci., Vol. 44(6), Dec. 1997, pp. 2150-2160.
  11. A. J. Tylka, W. F. Dietrich, and P. R. Boberg, "Probability distributions of high-energy solar-heavy-ion fluxes from IMP-8: 1973-1996", IEEE Trans. on Nucl. Sci.,Vol. 44(6), Dec. 1997, pp. 2140-2149.