SBVA067A December 2019 – September 2020 TLV733P-Q1
The failure mode distribution estimation for TLV733P-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| No OUTPUT (output low) | 50% |
| OUTPUT High (following input) | 10% |
| OUTPUT not in specification | 35% |
| Short circuit, any two pins | 5% |