SBVK009A August 2022 – November 2022 LP5912-EP
A new device can be qualified either by performing full-scale quality and reliability tests on the actual device or using previously qualified devices through the qualification by similarity" (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests are eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration. The QBS rules for a technology, product, test parameters, or package define which attributes are required to remain fixed for the QBS rules to apply. The attributes that are expected and allowed to vary are reviewed and a QBS plan is developed, based on the reliability impact assessment, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device is reviewed for conformance to the QBS rule sets applicable to that device. See JEDEC JESD47 for more information.
| Baseline(1) | |||
|---|---|---|---|
| Description | Condition | Description | Condition |
| TI device |
LP591209-EP LP591212-EP LP591218-EP LP591225-EP LP591230-EP LP591233-EP LP591250-EP |
Assembly site | TI CLARK (Philippines) |
| DLA VID |
V62/22601-01XE V62/22601-04XE V62/22601-06XE V62/22601-07XE V62/22601-09XE V62/22601-10XE V62/22601-11XE |
Test site | TI CLARK (Philippines) |
| Wafer fab | TI MIHO8 (Japan) | Pin, package type | WSON (DRV) | 6 |
| Fab process | LBC7T | Leadframe | Cu |
| Fab technology | CMOS | Termination finish | NiPdAu |
| Die revision | A | Mount compound | SUMITOMO CRM-1076NS |
| Die name | LLP5912MA3Z | Bond wire | 25.4 μm Au |
| ESD CDM | ±1000 V | Mold compound | SUMITOMO EME-G700LTD |
| ESD HBM | ±2000 V | Moisture sensitivity | MSL 2 / 260°C |
| Description | Condition | Sample Size (Allowed Rejects) | Lots Required | Test Method |
|---|---|---|---|---|
| Electromigration | Maximum recommended operating conditions | N/A | N/A | Per TI design rules |
| Wire bond life | Maximum recommended operating conditions | N/A | N/A | Per TI design rules |
| Electrical characterization | TI data sheet | 15 | 3 | N/A |
| Electrostatic discharge sensitivity | HBM | 3 units/voltage | N/A | EIA/JESD22-A114 or ANSI/ESDA/JEDEC JS-001 |
| CDM | EIA/JESD22-C101 or ANSI/ESDA/JEDEC JS-002 |
|||
| Latch-up | Per technology | 3(0) | 1 | EIA/JESD78 |
| Physical dimensions | TI data sheet | 5(0) | 1 | EIA/JESD22- B100 |
| Thermal impedance | θJA on board | Per pin-package | N/A | EIA/JESD51 |
| Bias life test | 125°C/1000 hours or equivalent | 45(0) | 3 | JESD22-A108(1) |
| Biased humidity | 85°C/85%/1000 hours | 77(0) | 3 | JESD22-A101(1) |
| or | ||||
| Biased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | JESD22-A110(1) | ||
| Extended biased humidity(2) | 85°C/85%/2600 hours | 77(–) | 1 | JESD22-A101(1) |
| or | ||||
| Extended biased HAST(2) | 130°C/85%/250 hours or 110°C/85%/687 hours | JESD22-A110(1) | ||
| Unbiased HAST | 130°C/85%/96 hours or 110°C/85%/264 hours | 77(0) | 3 | JESD22-A.118(1) |
| Temperature cycle | –65°C to +150°C non-biased for 500 cycles | 77(0) | 3 | JESD22-A104(1) |
| Solder heat | 230°C–250°C for 30-60 seconds | 22(0) | 1 | JESD22-B106 |
| Resistance to solvents | Ink symbol only | 12(0) | 1 | JESD22-B107 |
| Solderability | Bake preconditioning | 22(0) | 1 | ANSI/J-STD-002 |
| Flammability | Method A or method B | 5(0) | 1 | UL94 |
| Bond shear | Per wire size | 5 units × 30(0) bonds | 3 | JESD22-B116 |
| Bond pull strength | Per wire size | 5 units x 30(0) bonds | 3 | ASTM F-459 or TM2011 |
| Die shear | Per die size | 5(0) | 3 | TM 2019 |
| High temperature storage | 150°C / 1,000 hours | 15(0) | 3 | JESD22-A103(1) |
| Moisture sensitivity | Surface mount only | 12 | 1 | J-STD-020(1) |