5 Ongoing Reliability Monitoring

TI periodically monitors the reliability of products, wafer fab processes, and package technologies through the ongoing reliability monitor (ORM) program. The ORM program involves collecting environmental reliability stress data on representative sets of devices, processes and packages. The results from the ORM program are updated quarterly in this report.

TI Ongoing Reliability Monitoring Search web page link:

www.ti.com/orm/home?actionId=2801.html