SCDS418D July   2020  – September 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Source or Drain Continuous Current
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 7.7  ±15 V Dual Supply: Switching Characteristics 
    8. 7.8  ±20 V Dual Supply: Electrical Characteristics
    9. 7.9  ±20 V Dual Supply: Switching Characteristics
    10. 7.10 44 V Single Supply: Electrical Characteristics 
    11. 7.11 44 V Single Supply: Switching Characteristics 
    12. 7.12 12 V Single Supply: Electrical Characteristics 
    13. 7.13 12 V Single Supply: Switching Characteristics 
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  tON(EN) and tOFF(EN)
    6. 8.6  Break-Before-Make
    7. 8.7  tON (VDD) Time
    8. 8.8  Propagation Delay
    9. 8.9  Charge Injection
    10. 8.10 Off Isolation
    11. 8.11 Crosstalk
    12. 8.12 Bandwidth
    13. 8.13 THD + Noise
    14. 8.14 Power Supply Rejection Ratio (PSRR)
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 9.3.5 Fail-Safe Logic
      6. 9.3.6 Latch-Up Immune
      7. 9.3.7 Ultra-Low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

7.9 ±20 V Dual Supply: Switching Characteristics

VDD = +20 V ± 10%, VSS = –20 V ±10%, GND = 0 V (unless otherwise noted) 
Typical at VDD = +20 V, VSS = –20 V, TA = 25℃  (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
tTRAN Transition time from control input VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Transition Time 		25°C 115 208 ns
–40°C to +85°C 230 ns
–40°C to +125°C 248 ns
tON  (EN) Turn-on time from enable VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time 		25°C 115 205 ns
–40°C to +85°C 228 ns
–40°C to +125°C 248 ns
tOFF  (EN) Turn-off time from enable VS = 10 V
RL = 300 Ω, CL = 35 pF
Refer to Turn-on and Turn-off Time 		25°C 148 270 ns
–40°C to +85°C 285 ns
–40°C to +125°C 290 ns
tBBM Break-before-make time delay VS = 10 V,
RL = 300 Ω, CL = 35 pF
Refer to Break-Before-Make 		25°C 50 ns
–40°C to +85°C 1 ns
–40°C to +125°C 1 ns
TON (VDD) Device turn on time
(VDD to output)		 VDD rise time = 1 µs 
RL = 300 Ω, CL = 35 pF
Refer to Turn-on (VDD) Time 		25°C 0.15 ms
–40°C to +85°C 0.16 ms
–40°C to +125°C 0.16 ms
tPD Propagation delay RL = 50 Ω , CL = 5 pF
Refer to Propagation Delay 		25°C 1.8 ns
QINJ Charge injection VS = 0 V, CL = 100 pF
Refer to Charge Injection 		25°C 2 pC
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Off Isolation 		25°C –82 dB
OISO Off-isolation RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz
Refer to Off Isolation 		25°C –62 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 100 kHz
Refer to Crosstalk 		25°C –85 dB
XTALK Crosstalk RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1MHz
Refer to Crosstalk 		25°C –65 dB
BW –3dB Bandwidth (TMUX7208) RL = 50 Ω , CL = 5 pF
VS = 0 V
Refer to Bandwidth 		25°C 30 MHz
BW –3dB Bandwidth (TMUX7209) RL = 50 Ω , CL = 5 pF
VS = 0 V
Refer to Bandwidth 		25°C 52 MHz
IL Insertion loss RL = 50 Ω , CL = 5 pF
VS = 0 V, f = 1 MHz		 25°C –0.3 dB
ACPSRR AC Power Supply Rejection Ratio VPP = 0.62 V on VDD and VSS
RL = 50 Ω , CL = 5 pF,
f = 1 MHz
Refer to ACPSRR 		25°C –72 dB
THD+N Total Harmonic Distortion + Noise VPP = 20 V, VBIAS = 0 V
RL  =  10 kΩ , CL = 5 pF,
f = 20 Hz to 20 kHz
Refer to THD + Noise 		25°C 0.0003 %
CS(OFF) Source off capacitance VS = 0 V, f = 1 MHz 25°C 14 pF
CD(OFF) Drain off capacitance (TMUX7208) VS = 0 V, f = 1 MHz 25°C 130 pF
CD(OFF) Drain off capacitance (TMUX7209) VS = 0 V, f = 1 MHz 25°C 65 pF
CS(ON), CD(ON) On capacitance (TMUX7208) VS = 0 V, f = 1 MHz 25°C 180 pF
CS(ON), CD(ON) On capacitance (TMUX7209) VS = 0 V, f = 1 MHz 25°C 114 pF
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