SCDS445D May 2022 – September 2024
PRODUCTION DATA
The TMUX4051, TMUX4052, and TMUX4053 devices operate across a wide supply range of 5V to 24V.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply pins to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1μF to 10μF from VDD to ground and VSS to ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems or systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground planes.