SFFS028 June 2022 TMP112-Q1
1 Overview
This document contains information for TMP112-Q1 (SOT563-6 package) to aid in a functional safety system design. Information provided are:
- Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and their distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (Pin FMA)
Figure 1-1 shows the device functional block diagram for reference.
Figure 1-1 Functional Block DiagramTMP112-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.