SFFS030 October 2024 DP83TC812R-Q1 , DP83TG720S-Q1
The failure mode distribution estimation for the DP83TG720S-Q1 and DP83TG720R-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| Fault in MDI transmitter causes IEEE specification compliance issues | 6 |
| Fault in MDI transmitter causes high RF emissions | 3 |
| Fault in MDI receiver causes poor link quality and poor link loss | 5 |
| Fault in internal power circuits causes poor link quality and higher power consumption | 7 |
| Fault in internal clock circuits cause IEEE compliance issues and poor link quality | 5 |
| Fault in GPIO causes higher RF emissions | 5 |
| Fault in GPIO causes RGMII, JEDEC, and data sheet specification violation | 4 |
| Fault in ESD on MDI makes IEC ESD performance lower than 8KV | 3 |
| Fault in ESD on GPIOs makes CDM performance lower than 2KV | 2 |
| Digital core has stuck or transient faults that cause link-up or PCS faults | 60 |