4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TLV600x-Q1 (SC70 and SOIC package). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2)
Pin open-circuited (seeTable 4-3)
Pin short-circuited to an adjacent pin (see Table 4-4)
Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality
B	No device damage, but loss of functionality
C	No device damage, but performance degradation
D	No device damage, no impact to functionality or performance