SFFS055 March   2021 SN65HVD1780 , SN65HVD1781 , SN65HVD1782

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for SN65HVD1780, SN65HVD1781, and SN65HVD1782 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1780
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 19 27 13 23
Die FIT Rate 10 5 5 3
Package FIT Rate 9 22 9 20
Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1781
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 20 27 14 23
Die FIT Rate 11 5 6 3
Package FIT Rate 9 22 8 20
Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 for SN65HVD1782
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC high-K model FIT (Failures Per 109 Hours) 8-pin SOIC (D) JEDEC low-K model FIT (Failures Per 109 Hours) 8-pin PDIP (P) JEDEC low-K model
Total Component FIT Rate 26 30 16 25
Die FIT Rate 16 7 7 4
Package FIT Rate 10 23 9 21

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 290 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5 CMOS, BICMO
Digital analog / mixed
25 FIT 55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.