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SFFS191A March 2022 – October 2024 UCC27211A-Q1 , UCC27212A-Q1

2.2 SOIC Package

This section provides functional safety failure in time (FIT) rates for UCC27211A-Q1 (SOIC) based on two different industry-wide used reliability standards:

Table 2-3 provides FIT rates based on IEC TR 62380 / ISO 26262 part 1
Table 2-4 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-3 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	Power Dissipation (mW)	FIT (Failures Per 10⁹ Hours)
Total component FIT rate	50	10
Total component FIT rate	200	13
Die FIT rate	50	3
Die FIT rate	200	5
Package FIT rate	50	7
Package FIT rate	200	8

The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: Motor control from table 11
Power dissipation: 50mW, 200mW
Climate type: World-wide table 8
Package factor (lambda 3): Table 17b
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-4 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS Digital, analog, or mixed	20	55

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.