SFFS209 September 2021 TLV6703
This section provides a Failure Mode Analysis (FMA) for the pins of the TLV6703. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality |
| B | No device damage, but loss of functionality |
| C | No device damage, but performance degradation |
| D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TLV6703 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TLV6703 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Each pin is assesed individually
All other pins are configured correctly for device functionality
DSE Package pinout used for Pin No.
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
GND | 1 | No change if same node as GND | D |
VDD | 2 | Main supply shorted out (no power to device) | B |
GND | 3 | No change if same node as GND | D |
SENSE | 4 | Output goes low, if other input is positive | B |
GND | 5 | No change if same node as GND | D |
OUT | 6 | No change if GND pin is GND node | B |
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
GND | 1 | No effect | D |
VDD | 2 | Main suppy open (no power to device) | B |
GND | 3 | No effect | D |
SENSE | 4 | Output my be high or low | B |
GND | 5 | Lowest voltage pin will drive GND pin internally (via diode) | A |
OUT | 6 | Output cannot drive application load | B |
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|---|
| GND to VDD | 1 | 2 | Thermal stress due to high power dissipation | A |
| VDD to GND | 2 | 3 | No effect | D |
| GND to SENSE | 3 | 4 | No effect | D |
| SENSE to GND | 4 | 5 | Output goes low | B |
| GND to OUT | 5 | 6 | No change if GND pin is GND node | B |
| OUT to GND | 6 | 1 | No change if GND pin is GND node | B |
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
GND | 1 | Thermal stress due to high power dissipation | A |
VDD | 2 | No change if same node as VDD | D |
GND | 3 | No effect | D |
SENSE | 4 | Output goes high | B |
GND | 5 | Main supply shorted out (no power to device) | B |
OUT | 6 | Thermal stress due to high power dissipation | A |