SFFS222 October   2023 TMS320F2800153-Q1 , TMS320F2800154-Q1 , TMS320F2800155-Q1 , TMS320F2800156-Q1 , TMS320F2800157 , TMS320F2800157-Q1

 

  1.   1
  2.   Trademarks
  3. 1Introduction
  4. 2TMS320F280015x Hardware Component Functional Safety Capability
  5. 3TI Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
    2. 3.2 TI Functional Safety Development Process
  6. 4TMS320F280015x Component Overview
    1. 4.1 C2000 Architecture and Product Overview
      1. 4.1.1 TMS320F280015x MCU
    2. 4.2 Functional Safety Concept
      1. 4.2.1 VDA E-GAS Monitoring Concept With TMS320F280015x MCU
      2. 4.2.2 Fault Tolerant Time Interval (FTTI)
      3. 4.2.3 TMS320F280015x MCU Safe State
      4. 4.2.4 Operating States
    3. 4.3 C2000 Safety Diagnostics Libraries
      1. 4.3.1 Assumptions of Use - F280015x Self-Test Libraries
      2. 4.3.2 Operational Details - F280015x Self-Test Libraries
        1. 4.3.2.1 Operational Details – C28x Self-Test Library
        2. 4.3.2.2 Operational Details – SDL
      3. 4.3.3 C2000 Safety STL Software Development Flow
    4. 4.4 TMS320F280015x MCU Safety Implementation
      1. 4.4.1 Assumed Safety Requirements
      2. 4.4.2 Example Safety Concept Implementation Options on TMS320F280015x MCU
        1. 4.4.2.1 Safety Concept Implementation: Option 1
        2. 4.4.2.2 Safety Concept Implementation: Option 2
  7. 5Description of Safety Elements
    1. 5.1 TMS320F280015x MCU Infrastructure Components
      1. 5.1.1 Power Supply
      2. 5.1.2 Clock
      3. 5.1.3 APLL
      4. 5.1.4 Reset
      5. 5.1.5 System Control Module and Configuration Registers
      6. 5.1.6 JTAG Debug, Trace, Calibration, and Test Access
    2. 5.2 Processing Elements
      1. 5.2.1 C28x Central Processing Unit (CPU)
    3. 5.3 Memory (Flash, SRAM and ROM)
      1. 5.3.1 Embedded Flash Memory
      2. 5.3.2 Embedded SRAM
      3. 5.3.3 Embedded ROM
    4. 5.4 On-Chip Communication Including Bus-Arbitration
      1. 5.4.1 Device Interconnect
      2. 5.4.2 Enhanced Peripheral Interrupt Expander (ePIE) Module
      3. 5.4.3 Dual Zone Code Security Module (DCSM)
      4. 5.4.4 CrossBar (X-BAR)
      5. 5.4.5 Timer
    5. 5.5 Digital I/O
      1. 5.5.1 General-Purpose Input/Output (GPIO) and Pinmuxing
      2. 5.5.2 Enhanced Pulse Width Modulators (ePWM)
      3. 5.5.3 High Resolution PWM (HRPWM)
      4. 5.5.4 Enhanced Capture (eCAP)
      5. 5.5.5 Enhanced Quadrature Encoder Pulse (eQEP)
      6. 5.5.6 External Interrupt (XINT)
    6. 5.6 Analog I/O
      1. 5.6.1 Analog-to-Digital Converter (ADC)
      2. 5.6.2 Comparator Subsystem (CMPSS)
    7. 5.7 Data Transmission
      1. 5.7.1 Controller Area Network (DCAN)
      2. 5.7.2 Controller Area Network (MCAN, CAN FD)
      3. 5.7.3 Serial Peripheral Interface (SPI)
      4. 5.7.4 Serial Communication Interface (SCI)
      5. 5.7.5 Inter-Integrated Circuit (I2C)
      6. 5.7.6 Local Interconnect Network (LIN)
  8. 6Management of Random Faults
    1. 6.1 Fault Reporting
    2. 6.2 Suggestions for Improving Freedom From Interference
    3. 6.3 Suggestions for Addressing Common Cause Failures
    4. 6.4 Description of Functional Safety Mechanisms
      1. 6.4.1 TMS320F280015x MCU Infrastructure Components
        1. 6.4.1.1  Clock Integrity Check Using DCC
        2. 6.4.1.2  Clock Integrity Check Using CPU Timer
        3. 6.4.1.3  Clock Integrity Check Using HRPWM
        4. 6.4.1.4  EALLOW Protection for Critical Registers
        5. 6.4.1.5  External Monitoring of Clock via XCLKOUT
        6. 6.4.1.6  External Monitoring of Warm Reset (XRSn)
        7. 6.4.1.7  External Voltage Supervisor
        8. 6.4.1.8  External Watchdog
        9. 6.4.1.9  Glitch Filtering on Reset Pins
        10. 6.4.1.10 Hardware Disable of JTAG Port
        11. 6.4.1.11 Lockout of JTAG Access Using OTP
        12. 6.4.1.12 Internal Watchdog (WD)
        13. 6.4.1.13 Lock Mechanism for Control Registers
        14. 6.4.1.14 Missing Clock Detect (MCD)
        15. 6.4.1.15 NMIWD Reset Functionality
        16. 6.4.1.16 NMIWD Shadow Registers
        17. 6.4.1.17 Multi-Bit Enable Keys for Control Registers
        18. 6.4.1.18 Online Monitoring of Temperature
        19. 6.4.1.19 Periodic Software Read Back of Static Configuration Registers
        20. 6.4.1.20 Peripheral Clock Gating (PCLKCR)
        21. 6.4.1.21 Peripheral Soft Reset (SOFTPRES)
        22. 6.4.1.22 Software Test of Reset - Type 1
        23. 6.4.1.23 PLL Lock Profiling Using On-Chip Timer
        24. 6.4.1.24 Reset Cause Information
        25. 6.4.1.25 Software Read Back of Written Configuration
        26. 6.4.1.26 Software Test of ERRORSTS Functionality
        27. 6.4.1.27 Software Test of Missing Clock Detect Functionality
        28. 6.4.1.28 Software Test of Watchdog (WD) Operation
        29. 6.4.1.29 Dual-Clock Comparator (DCC) - Type 2
        30. 6.4.1.30 PLL Lock Indication
        31. 6.4.1.31 Software Test of DCC Functionality Including Error Tests
        32. 6.4.1.32 Software Test of PLL Functionality Including Error Tests
        33. 6.4.1.33 Interleaving of FSM States
        34. 6.4.1.34 Brownout Reset (BOR)
      2. 6.4.2 Processing Elements
        1. 6.4.2.1  CPU Handling of Illegal Operation, Illegal Results and Instruction Trapping
        2. 6.4.2.2  Software Test of CPU
        3. 6.4.2.3  Stack Overflow Detection
        4. 6.4.2.4  VCRC Check of Static Memory Contents
        5. 6.4.2.5  VCRC Auto Coverage
        6. 6.4.2.6  Hardware Redundancy Using Lockstep Compare Module (LCM)
        7. 6.4.2.7  Self-test Logic for LCM
        8. 6.4.2.8  LCM Compare Error Forcing Mode
        9. 6.4.2.9  LCM MMR Parity
        10. 6.4.2.10 Test of LCM MMR Parity
        11. 6.4.2.11 Lockstep Self-test Mux Select Logic Fault Detection
        12. 6.4.2.12 Redundancy in LCM Comparator
      3. 6.4.3 Memory (Flash, SRAM and ROM)
        1. 6.4.3.1  Bit Multiplexing in Flash Memory Array
        2. 6.4.3.2  Bit Multiplexing in SRAM Memory Array
        3. 6.4.3.3  Data Scrubbing to Detect/Correct Memory Errors
        4. 6.4.3.4  Flash ECC
        5. 6.4.3.5  Flash Program Verify and Erase Verify Check
        6. 6.4.3.6  Flash Program/Erase Protection
        7. 6.4.3.7  Flash Wrapper Error and Status Reporting
        8. 6.4.3.8  Prevent 0 to 1 Transition Using Program Command
        9. 6.4.3.9  On-demand Software Program Verify and Blank Check
        10. 6.4.3.10 CMDWEPROT* and Program Command Data Buffer Registers Self-Clear After Command Execution
        11. 6.4.3.11 ECC Generation and Checker Logic is Separate in Hardware
        12. 6.4.3.12 Auto ECC Generation Override
        13. 6.4.3.13 Software Test of ECC Logic
        14. 6.4.3.14 Software Test of Flash Prefetch, Data Cache and Wait-States
        15. 6.4.3.15 Access Protection Mechanism for Memories
        16. 6.4.3.16 SRAM ECC
        17. 6.4.3.17 SRAM Parity
        18. 6.4.3.18 Software Test of Parity Logic
        19. 6.4.3.19 Software Test of SRAM
        20. 6.4.3.20 Memory Power-On Self-Test (MPOST)
        21. 6.4.3.21 ROM Parity
      4. 6.4.4 On-Chip Communication Including Bus-Arbitration
        1. 6.4.4.1 1oo2 Software Voting Using Secondary Free Running Counter
        2. 6.4.4.2 Maintaining Interrupt Handler for Unused Interrupts
        3. 6.4.4.3 Power-Up Pre-Operational Security Checks
        4. 6.4.4.4 Majority Voting and Error Detection of Link Pointer
        5. 6.4.4.5 Software Check of X-BAR Flag
        6. 6.4.4.6 Software Test of ePIE Operation Including Error Tests
      5. 6.4.5 Digital I/O
        1. 6.4.5.1  eCAP Application Level Safety Mechanism
        2. 6.4.5.2  ePWM Application Level Safety Mechanism
        3. 6.4.5.3  ePWM Fault Detection Using X-BAR
        4. 6.4.5.4  ePWM Synchronization Check
        5. 6.4.5.5  eQEP Application Level Safety Mechanism
        6. 6.4.5.6  eQEP Quadrature Watchdog
        7. 6.4.5.7  eQEP Software Test of Quadrature Watchdog Functionality
        8. 6.4.5.8  Hardware Redundancy
        9. 6.4.5.9  HRPWM Built-In Self-Check and Diagnostic Capabilities
        10. 6.4.5.10 Information Redundancy Techniques
        11. 6.4.5.11 Monitoring of ePWM by eCAP
        12. 6.4.5.12 Monitoring of ePWM by ADC
        13. 6.4.5.13 Online Monitoring of Periodic Interrupts and Events
        14. 6.4.5.14 Software Test of Function Including Error Tests
        15. 6.4.5.15 QMA Error Detection Logic
      6. 6.4.6 Analog I/O
        1. 6.4.6.1 ADC Information Redundancy Techniques
        2. 6.4.6.2 ADC Input Signal Integrity Check
        3. 6.4.6.3 ADC Signal Quality Check by Varying Acquisition Window
        4. 6.4.6.4 CMPSS Ramp Generator Functionality Check
        5. 6.4.6.5 DAC to ADC Loopback Check
        6. 6.4.6.6 Opens/Shorts Detection Circuit for ADC
        7. 6.4.6.7 Disabling Unused Sources of SOC Inputs to ADC
      7. 6.4.7 Data Transmission
        1. 6.4.7.1  Information Redundancy Techniques Including End-to-End Safing
        2. 6.4.7.2  Bit Error Detection
        3. 6.4.7.3  CRC in Message
        4. 6.4.7.4  DCAN Acknowledge Error Detection
        5. 6.4.7.5  DCAN Form Error Detection
        6. 6.4.7.6  DCAN Stuff Error Detection
        7. 6.4.7.7  PWM Trip by MCAN
        8. 6.4.7.8  MCAN Acknowledge Error Detection
        9. 6.4.7.9  MCAN Form Error Detection
        10. 6.4.7.10 MCAN Stuff Error Detection
        11. 6.4.7.11 Timeout on FIFO Activity
        12. 6.4.7.12 Timestamp Consistency Checks
        13. 6.4.7.13 Tx-Event Checks
        14. 6.4.7.14 Interrupt on Message RAM Access Failure
        15. 6.4.7.15 Software Test of Function Including Error Tests Using EPG
        16. 6.4.7.16 I2C Access Latency Profiling Using On-Chip Timer
        17. 6.4.7.17 I2C Data Acknowledge Check
        18. 6.4.7.18 Parity in Message
        19. 6.4.7.19 SCI Break Error Detection
        20. 6.4.7.20 Frame Error Detection
        21. 6.4.7.21 Overrun Error Detection
        22. 6.4.7.22 Software Test of Function Using I/O Loopback
        23. 6.4.7.23 SPI Data Overrun Detection
        24. 6.4.7.24 Transmission Redundancy
        25. 6.4.7.25 LIN Physical Bus Error Detection
        26. 6.4.7.26 LIN No-Response Error Detection
        27. 6.4.7.27 LIN Checksum Error Detection
        28. 6.4.7.28 Data Parity Error Detection
        29. 6.4.7.29 LIN ID Parity Error Detection
        30. 6.4.7.30 PMBus Protocol CRC in Message
        31. 6.4.7.31 Clock Timeout
        32. 6.4.7.32 Communication Access Latency Profiling Using On-Chip Timer
  9. 7References
  10.   A Summary of Safety Features and Diagnostics
  11.   B Distributed Developments
    1.     B.1 How the Functional Safety Lifecycle Applies to Functional Safety-Compliant Products
    2.     B.2 Activities Performed by Texas Instruments
    3.     B.3 Information Provided

3.2 TI Functional Safety Development Process

The TI functional safety development flow derives from ISO 26262:2018 and IEC 61508:2010 a set of requirements and methodologies to be applied to semiconductor development. This flow is combined with TI's standard new product development process to develop Functional Safety-Compliant components. The details of this functional safety development flow are described in the TI internal specification - Functional Safety Hardware.

Key elements of the TI functional safety-development flow are as follows:

  • Assumptions on system level design, functional safety concept, and requirements based on TI's experience with components in functional safety applications
  • Qualitative and quantitative functional safety analysis techniques including analyses of silicon failure modes and application of functional safety mechanisms
  • Base FIT rate estimation based on multiple industry standards and TI manufacturing data
  • Documentation of functional safety work products during the component development
  • Integration of lessons learned through multiple functional safety component developments, functional safety standard working groups, and the expertise of TI customers

Table 3-1 lists these functional safety development activities that are overlaid atop the standard development flow in Figure 3-1.

For more information about which functional safety lifecycle activities TI performs, see Appendix B.

The customer facing work products derived from this Functional Safety-Compliant process are applicable to many other functional safety standards beyond ISO 26262:2018 and IEC 61508:2010.

Table 3-1 Functional Safety Activities Overlaid on Top of TI's Standard Development Process
Assess Plan Create Validate Sustain and End-of-Life
Determine if functional safety process execution is required Define component target SIL/ASIL capability Develop component level functional safety requirements Validate functional safety design in silicon Document any reported issues (as needed)
Nominate a functional safety manager Generate functional safety plan Include functional safety requirements in design specification Characterize the functional safety design Perform incident reporting of sustaining operations (as needed)
End of Phase Audit Verify the functional safety plan Verify the design specification Qualify the functional safety design (per AEC-Q100) Update work products (as needed)
Initiate functional safety case Start functional safety design Finalize functional safety case
Analyze target applications to generate system level functional safety assumptions Perform qualitative analysis of design (i.e. failure mode analysis) Perform assessment of project
End of Phase Audit Verify the qualitative analysis Release functional safety manual
Verify the functional safety design Release functional safety analysis report
Perform quantitative analysis of design (i.e. FMEDA) Release functional safety report
Verify the quantitative analysis End of Phase Audit
Iterate functional safety design as necessary
End of Phase Audit
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