1 Overview

This document contains information for TLV3601 (DCK and DBV packages) and TLV3602 (DGK and DSG packages) to aid in a functional safety system design. Information provided are:

• Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram of single channel for reference.

TLV3601 and TLV3602 were developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

ADVANCE INFORMATION for preproduction products; subject to change without notice.