SFFS246 August   2022 TCAN4550-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)
    1. 2.1 Random Fault Estimation
      1. 2.1.1 Fault Rate Estimation Theory for Packaging
      2. 2.1.2 Fault Estimation Theory for Silicon Permanent Faults
      3. 2.1.3 Fault Estimation Theory for Silicon Transient Faults
      4. 2.1.4 The Classification of Failure Categories and Calculation
    2. 2.2 Using the FMEDA Spreadsheet Tool
      1. 2.2.1 Mission Profile Tailoring Tab
        1. 2.2.1.1 Geographical Location
        2. 2.2.1.2 Life Cycle
        3. 2.2.1.3 Use Case Thermal Management Control (Theta-Ja) and Use Case Power
        4. 2.2.1.4 Safe vs Non-Safe (Safe Fail Fraction) for Each Component Type
        5. 2.2.1.5 Analog FIT Distribution Method
        6. 2.2.1.6 Operational Profile
      2. 2.2.2 Pin Level Tailoring Tab
      3. 2.2.3 Function and Diag Tailoring Tab
      4. 2.2.4 Diagnostic Coverage Tab
      5. 2.2.5 Customer Defined Diagnostics Tab
      6. 2.2.6 Totals - ISO26262 Tab
      7. 2.2.7 Details - ISO26262 Tab
    3. 2.3 Example Calculation of Metrics
      1. 2.3.1 Assumptions of Use for Calculation of Safety Metrics
      2. 2.3.2 Summary of ISO 26262 Safety Metrics at Device Level

2.2.1 Mission Profile Tailoring Tab

The user is expected to tailor this sheet to their specific use-case.

This section describes the steps needed to configure the 'Mission Profile Tailoring' tab of the device FMEDA for a specific application or use-case. All of the selections that can be made in this tab impacts the raw (base) FIT rate of the device or the safety related FIT of the device.
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