SFFS246 August   2022 TCAN4550-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)
    1. 2.1 Random Fault Estimation
      1. 2.1.1 Fault Rate Estimation Theory for Packaging
      2. 2.1.2 Fault Estimation Theory for Silicon Permanent Faults
      3. 2.1.3 Fault Estimation Theory for Silicon Transient Faults
      4. 2.1.4 The Classification of Failure Categories and Calculation
    2. 2.2 Using the FMEDA Spreadsheet Tool
      1. 2.2.1 Mission Profile Tailoring Tab
        1. 2.2.1.1 Geographical Location
        2. 2.2.1.2 Life Cycle
        3. 2.2.1.3 Use Case Thermal Management Control (Theta-Ja) and Use Case Power
        4. 2.2.1.4 Safe vs Non-Safe (Safe Fail Fraction) for Each Component Type
        5. 2.2.1.5 Analog FIT Distribution Method
        6. 2.2.1.6 Operational Profile
      2. 2.2.2 Pin Level Tailoring Tab
      3. 2.2.3 Function and Diag Tailoring Tab
      4. 2.2.4 Diagnostic Coverage Tab
      5. 2.2.5 Customer Defined Diagnostics Tab
      6. 2.2.6 Totals - ISO26262 Tab
      7. 2.2.7 Details - ISO26262 Tab
    3. 2.3 Example Calculation of Metrics
      1. 2.3.1 Assumptions of Use for Calculation of Safety Metrics
      2. 2.3.2 Summary of ISO 26262 Safety Metrics at Device Level

2 Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)

This section describes the device FMEDA, the assumptions made within, the options for tailoring, and provides an example calculation of device functional safety metrics.
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