SFFS252 august 2023 TLV1851 , TLV1851-Q1 , TLV1861 , TLV1861-Q1
This section provides Functional Safety Failure In Time (FIT) rates for TLV1852-Q1 and TLV1862-Q1 based on two different industry-wide used reliability standards:
FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) For VSSOP (8) Package |
FIT (Failures Per 109
Hours) For SOIC (8) Package |
---|---|---|
Total Component FIT Rate | 7 | 14 |
Die FIT Rate | 3 | 3 |
Package FIT Rate | 4 | 11 |
The failure rate and mission profile information in Table 3-3 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:
Table | Category | Reference FIT Rate | Reference Virtual TJ |
---|---|---|---|
4 | CMOS, BICMOS Digital, analog / mixed | 12 FIT | 55°C |
The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 3-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.