1 Overview

This document contains information for the TIC12400-Q1 (TSSOP package) and TIC10024-Q1 (TSSOP package) to aid in a functional safety system design. Information provided are:

• Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

The TIC12400-Q1 and TIC10024-Q1 were both developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.