1 Overview

This document contains information for the TPSM63606 (B3QFN package) to aid in a functional safety system design. Information provided are:

• Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

TPSM63606 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.