SFFS339 December   2022 TLIN1431-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)
    1. 2.1 Random Fault Estimation
      1. 2.1.1 Fault Rate Estimation Theory for Packaging
      2. 2.1.2 Fault Estimation Theory for Silicon Permanent Faults
      3. 2.1.3 Fault Estimation Theory for Silicon Transient Faults
      4. 2.1.4 The Classification of Failure Categories and Calculation
  4. 3Using the FMEDA Spreadsheet Tool
    1. 3.1 Mission Profile Tailoring Tab
      1. 3.1.1 Geographical Location
      2. 3.1.2 Life Cycle
      3. 3.1.3 Use Case Thermal Management Control (Theta-Ja) and Use Case Power
      4. 3.1.4 Safe vs Non-Safe (Safe Fail Fraction) for Each Component Type
      5. 3.1.5 Analog FIT Distribution Method
      6. 3.1.6 Operational Profile
    2. 3.2 Pin Level Tailoring Tab
    3. 3.3 Function and Diag Tailoring Tab
    4. 3.4 Diagnostic Coverage Tab
    5. 3.5 Customer Defined Diagnostics Tab
    6. 3.6 Totals - ISO26262 Tab
    7. 3.7 Details - ISO26262 Tab
    8. 3.8 Example Calculation of Metrics
      1. 3.8.1 Assumptions of Use for Calculation of Safety Metrics
      2. 3.8.2 Summary of ISO 26262 Safety Metrics at Device Level

3.1.5 Analog FIT Distribution Method

This section is informational only, there is no user input required. IEC62380 and SN29500 use the total Mbit and/or transistor count to determine a base level FIT. If "Transistor" is selected, we proportion out the Analog FIT based on its raw transistor count. If "Area" is selected, then proportion out the FIT rate based on the part relative size to the chip. This does not change the overall Base FIT of the device, just the distribution of the Base FIT.
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