SFFS363 January 2022 TMAG5123-Q1

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TMAG5123-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Pin short-circuited to ground (see Table 4-2)
Pin open-circuited (see Table 4-3)
Pin short-circuited to an adjacent pin (see Table 4-4)
Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects

Class	Failure Effects
A	Potential device damage that affects functionality.
B	No device damage, but loss of functionality.
C	No device damage, but performance degradation.
D	No device damage, no impact to functionality or performance.

Figure 4-1 shows the TMAG5123-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TMAG5123-Q1 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

T_A= -40°C to +150°C
V_CC = 2.7 V to 28 V

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground

Pin Name	Pin No.	Description of Potential Failure Effect(s)	Failure Effect Class
VCC	1	A lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.	B
OUT	2	Device not damaged and output stuck at LOW state.	B
GND	3	Normal Operation.	D

Table 4-3 Pin FMA for Device Pins Open-Circuited

Pin Name	Pin No.	Description of Potential Failure Effect(s)	Failure Effect Class
VCC	1	OUT stuck in HIGH state.	B
OUT	2	A transition to HIGH may be slow or not occur a all.	B
GND	3	No damage, output stuck in HIGH state.	B

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin

Pin Name	Pin No.	Shorted to	Description of Potential Failure Effect(s)	Failure Effect Class
VCC	1	2-OUT	The output will sink current limited by the power supply. The output signal will be pulled to VCC. If the device B_OP threshold is triggered, the device may be damaged. If the ambient field remains below the B_RP threshold, the device will not be damaged.	A
OUT	2	3-GND	Device not damaged and output stuck in LOW state.	B
GND	3	1-VCC	A lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.	B

Table 4-5 Pin FMA for Device Pins Short-Circuited to supply

Pin Name	Pin No.	Description of Potential Failure Effect(s)	Failure Effect Class
VCC	1	Normal Operation	D
OUT	2	The output will sink current limited by the power supply. The output signal will be pulled to VCC. If the device B_OP threshold is triggered, the device may be damaged. If the ambient field remains below the B_RP threshold, the device will not be damaged.	A
GND	3	A lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.	B