SFFS431 July 2022 ISO6762 , ISO6762-Q1
4.1 16-QSOP (SSOP) and 16-DW (wide-body SOIC) Package
Figure 4-1 shows the ISO6762/ISO6762-Q1 pin diagram for 16-DW packages. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the ISO6762/ISO6762-Q1 data sheet.
Figure 4-1 Pin Diagram 16-DW PackageTable 4-2 Pin FMA for Device Pins
Short-Circuited to Ground
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | No power to the device on side-1. OUTA-OUTD go to default state, while OUTE/OUTF undetermined state. Observe that the absolute maximum ratings for all pins of the device are met; otherwise device damage may be plausible. | A |
| INA | 2 | Input signal shorted to ground, so output (OUTA) stuck to low. Communication from INA to OUTA corrupted. | B |
| INB | 3 | Input signal shorted to ground, so output (OUTB) stuck to low. Communication from INB to OUTB corrupted. | B |
| INC | 4 | Input signal shorted to ground, so output (OUTC) stuck to low. Communication from INC to OUTC corrupted. | B |
| IND | 5 | Input signal shorted to ground, so output (OUTD) stuck to low. Communication from IND to OUTD corrupted. | B |
| OUTE | 6 | OUTE stuck low. Data communication from INE to OUTE lost. Device damage possible if INE is driven high for extended period of time. | A |
| OUTF | 7 | OUTF stuck low. Data communication from INF to OUTF lost. Device damage possible if INF is driven high for extended period of time. | A |
| GND1 | 8 | Device continues to function as expected. Normal operation. | D |
| GND2 | 9 | Device continues to function as expected. Normal operation. | D |
| INF | 10 | Input signal shorted to ground, so output (OUTF) stuck to low. Communication from INF to OUTF corrupted. | B |
| INE | 11 | Input signal shorted to ground, so output (OUTE) stuck to low. Communication from INE to OUTE corrupted. | B |
| OUTD | 12 | OUTD stuck low. Data communication from IND to OUTD lost. Device damage possible if IND is driven high for extended period of time. | A |
| OUTC | 13 | OUTC stuck low. Data communication from INC to OUTC lost. Device damage possible if INC is driven high for extended period of time. | A |
| OUTB | 14 | OUTB stuck low. Data communication from INB to OUTB lost. Device damage possible if INB is driven high for extended period of time. | A |
| OUTA | 15 | OUTA stuck low. Data communication from INA to OUTA lost. Device damage possible if INA is driven high for extended period of time. | A |
| VCC2 | 16 | No power to the device on side-2. OUTA to OUTD pins state undetermined. OUTE/OUTF in default state. | B |
Table 4-3 Pin FMA for Device Pins
Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | Operation undetermined. Either device is unpowered and OUTA to OUTD=default logic state or through internal ESD diode on any IN pin, device can power up if any IN is driven to logic high. If IN has current sourcing capability to provide regular operating current of device, ESD diode conducts that current and device damage plausible. | A |
| INA | 2 | No communication to INA channel possible. OUTA stuck to default state (High for ISO6762-Q1 and Low for ISO6762F-Q1). | B |
| INB | 3 | No communication to INB channel possible. OUTB stuck to default state (High for ISO6762-Q1 and Low for ISO6762F-Q1). | B |
| INC | 4 | No communication to INC channel possible. OUTC stuck to default state (High for ISO6762-Q1 and Low for ISO6762F-Q1). | B |
| IND | 5 | No communication to IND channel possible. OUTD stuck to default state (High for ISO6761-Q1 and Low for ISO6761F-Q1). | B |
| OUTE | 6 | State of OUTE undetermined. Data communication from INE to OUTE lost. | B |
| OUTF | 7 | State of OUTF undetermined. Data communication from INF to OUTF lost. | B |
| GND1 | 8 | Device unpowered on side1. OUTx on side2 go to default state. OUTE/OUTF state undetermined. | B |
| GND2 | 9 | Device unpowered on side2. OUTx on side2 state undetermined. OUTE/OUTF goes to default state. | B |
| INF | 10 | No communication to INF channel possible. OUTF stuck to default state (High for ISO6762-Q1 and Low for ISO6762F-Q1). | B |
| INE | 11 | No communication to INEF channel possible. OUTE stuck to default state (High for ISO6762-Q1 and Low for ISO6762F-Q1). | B |
| OUTD | 12 | State of OUTD undetermined. Data communication from IND to OUTD lost. | B |
| OUTC | 13 | State of OUTC undetermined. Data communication from INC to OUTC lost. | B |
| OUTB | 14 | State of OUTB undetermined. Data communication from INB to OUTB lost. | B |
| OUTA | 15 | State of OUTA undetermined. Data communication from INA to OUTA lost. | B |
| VCC2 | 16 | Device unpowered on side-2 and state of OUTx on side-2 undetermined. OUTE/OUTF go to default state. | B |
Table 4-4 Pin FMA for Device Pins
Short-Circuited to Adjacent Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|---|
| VCC1 | 1 | INA | Input signal shorted to supply, so output (OUTA) stuck to high. Communication from INA to OUTA corrupted. | B |
| INA | 2 | INB | Communication corrupted for either INA or INB channel. | B |
| INB | 3 | INC | Communication corrupted for either INC or INB channel. | B |
| INC | 4 | IND | Communication corrupted for either INC or IND channel. | B |
| IND | 5 | OUTE | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTE | 6 | OUTF | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTF | 7 | GND1 | OUTF stuck low. Data communication from INF to OUTF lost. Device damage possible if INF is driven high for extended period of time. | A |
| GND1 | 8 | OUTF | Already considered in above row. | B |
| GND2 | 9 | INF | Input signal shorted to ground, so output (OUTF) stuck low. Communication from INF to OUTF corrupted. | B |
| INF | 10 | INE | Communication corrupted for either INE or INF channel. | B |
| INE | 11 | OUTD | Communication corrupted for either or both channels. With opposite logic state on both channels, high current can flow between supply and ground and cause possible device damage. | A |
| OUTD | 12 | OUTC | Communication corrupted for either OUTD or OUTC channel. Device damage possible if INC and IND try to drive opposite logic state for extended duration creating a short between supply and ground on side-2. | A |
| OUTC | 13 | OUTB | Communication corrupted for either OUTC or OUTB channel. Device damage possible if INC and INB try to drive opposite logic state for extended duration creating a short between supply and ground on side-2. | A |
| OUTB | 14 | OUTA | Communication corrupted for either OUTA or OUTB channel. Device damage possible if INA and INB try to drive opposite logic state for extended duration creating a short between supply and ground on side-2. | A |
| OUTA | 15 | VCC2 | OUTA stuck high. Data communication from INA to OUTA lost. Device damage possible if INA is driven low for extended period of time. | A |
| VCC2 | 16 | OUTA | Already considered in above row. | A |
Table 4-5 Pin FMA for Device Pins Short-Circuited to
supply
| Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
|---|---|---|---|
| VCC1 | 1 | No effect. Normal operation. | D |
| INA | 2 | INA pin stuck high. Communication corrupted. OUTA state high. | B |
| INB | 3 | INB pin stuck high. Communication corrupted. OUTB state high. | B |
| INC | 4 | INC pin stuck high. Communication corrupted. OUTC state high. | B |
| IND | 5 | IND pin stuck high. Communication corrupted. OUTD state high. | B |
| OUTE | 6 | OUTE stuck high. Communication disrupted. If INE is low for extended duration, OUTE being stuck high creates a short and can damage the device. | A |
| OUTF | 7 | OUTF stuck high. Communication disrupted. If INF is low for extended duration, OUTF being stuck high creates a short and can damage the device. | A |
| GND1 | 8 | Device unpowered on side1. OUTx on side-2 go to default state. OUTE/OUTF state undetermined. | B |
| GND2 | 9 | Device unpowered on side2. OUTx on side-2 state undetermined. OUTE/OUTF go to default state. | B |
| INF | 10 | INF pin stuck high. Communication corrupted. OUTF state high. | B |
| INE | 11 | INE pin stuck high. Communication corrupted. OUTE state high. | B |
| OUTD | 12 | OUTD stuck high. Communication disrupted. If IND is low for extended duration, OUTD being stuck high creates a short and can damage the device. | A |
| OUTC | 13 | OUTC stuck high. Communication disrupted. If INC is low for extended duration, OUTC being stuck high creates a short and can damage the device. | A |
| OUTB | 14 | OUTB stuck high. Communication disrupted. If INB is low for extended duration, OUTB being stuck high creates a short and can damage the device. | A |
| OUTA | 15 | OUTA stuck high. Communication disrupted. If INA is low for extended duration, OUTA being stuck high creates a short and can damage the device. | A |
| VCC2 | 16 | Device continues to function as expected. Normal operation. | D |