SFFS479 May 2022 ISOW7741-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the ISOW7741-Q1 in 20-DFM package. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1. Note that when pin short to ground case is discussed, only same side ground shorts are considered.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |