SFFS556 March   2023 ADS1114-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 VSSOP Package
    2. 2.2 UQFN Package
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 VSSOP Package
    2. 4.2 UQFN Package

VSSOP Package

Figure 4-1 shows the ADS1114-Q1 pin diagram for the VSSOP package. For a detailed description of the device pins, see the Pin Configuration and Functions section in the ADS1114-Q1 data sheet.

GUID-20230307-SS0I-PG4Z-GQB6-XN4DMKVXJ177-low.svg Figure 4-1 Pin Diagram (VSSOP) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
ADDR 1 Pullup resistor on the ADDR pin to VDD: ADDR is stuck low. No I2C communication with the device is possible because of change in I2C address configuration. B
Pulldown resistor on the ADDR pin to GND: ADDR is stuck low. No effect. Normal operation. D
ALERT/RDY 2 ALERT/RDY is stuck low. No or incorrect alert or data-ready indication to host. B
GND 3 No effect. Normal operation. D
AIN0 4 AIN0 is stuck low. Conversion results for multiplexer channel combinations using AIN0 are corrupted, unless AIN0 is tied to GND anyway. B
AIN1 5 AIN1 is stuck low. Conversion results for multiplexer channel combinations using AIN1 are corrupted, unless AIN1 is tied to GND anyway. B
NC 6 No effect. Normal operation. D
NC 7 No effect. Normal operation. D
VDD 8 The device is unpowered and not functional. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage is plausible. A
SDA 9 SDA is stuck low. No I2C communication with the device is possible. B
SCL 10 SCL is stuck low. No I2C communication with the device is possible. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
ADDR 1 The state of the ADDR input is undetermined. The I2C address of the device is undetermined. I2C communication with the device is not possible if the host assumes a different I2C address than the device is set to. B
ALERT/RDY 2 No alert or data-ready indication to the host is possible. B
GND 3 Device functionality is undetermined. The device can be unpowered or connected to ground internally through an alternate pin ESD diode and power up. B
AIN0 4 The state of the AIN0 input is undetermined. Conversion results for multiplexer channel combinations using AIN0 are undetermined. B
AIN1 5 The state of the AIN1 input is undetermined. Conversion results for multiplexer channel combinations using AIN1 are undetermined. B
NC 6 No effect. Normal operation. D
NC 7 No effect. Normal operation. D
VDD 8 Device functionality is undetermined. The device is unpowered if all external analog and digital pins are held low. The device can power up through internal ESD diodes to VDD if voltages above the device power-on reset threshold are present on any of the analog or digital pins. B
SDA 9 No I2C communication with the device is possible. B
SCL 10 No I2C communication with the device is possible. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effects Failure Effect Class
ADDR 1 ALERT/RDY Pullup resistor on the ADDR pin to VDD: I2C communication is corrupted because of change in I2C address configuration when ALERT/RDY drives low. B
Pulldown resistor on the ADDR pin to GND: I2C address of the device is undetermined when ALERT/RDY drives high. I2C communication with the device is not possible if the host assumes a different I2C address than the device is set to. No or incorrect alert or data-ready indication to host. B
ALERT/RDY 2 GND ALERT/RDY is stuck low. No or incorrect alert or data-ready indication to host. B
GND 3 AIN0 AIN0 is stuck low. Conversion results for multiplexer channel combinations using AIN0 are corrupted, unless AIN0 is tied to GND anyway. B
AIN0 4 AIN1 Conversion results for multiplexer channel combinations using AIN0 or AIN1 are undetermined. B
AIN1 5 NC Not considered. Corner pin. D
NC 6 NC No effect. Normal operation. D
NC 7 VDD No effect. Normal operation. D
VDD 8 SDA SDA is stuck high. No I2C communication with the device is possible. High SDA input current when the device tries to drive SDA low. Device damage is plausible. A
SDA 9 SCL I2C communication is corrupted. No I2C communication with the device is possible. B
SCL 10 ADDR Not considered. Corner pin. D
Table 4-5 Pin FMA for Device Pins Short-Circuited to VDD
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
ADDR 1 Pullup resistor on the ADDR pin to VDD: ADDR is stuck high. No effect. Normal operation. D
Pulldown resistor on the ADDR pin to GND: ADDR is stuck high. No I2C communication with the device is possible because of change in I2C address configuration. B
ALERT/RDY 2 ALERT/RDY is stuck high. No or incorrect alert or data-ready indication to host. High ALERT/RDY input current when ALERT/RDY tries to drive low. Device damage is plausible. A
GND 3 The device is unpowered and not functional. Observe that the absolute maximum ratings for all pins of the device are met, otherwise device damage is plausible. A
AIN0 4 AIN0 is stuck high. Conversion results for multiplexer channel combinations using AIN0 are corrupted, unless AIN0 is tied to VDD anyway. B
AIN1 5 AIN1 is stuck high. Conversion results for multiplexer channel combinations using AIN1 are corrupted, unless AIN1 is tied to VDD anyway. B
NC 6 No effect. Normal operation. D
NC 7 No effect. Normal operation. D
VDD 8 No effect. Normal operation. D
SDA 9 SDA is stuck high. No I2C communication with the device is possible. High SDA input current when the device tries to drive SDA low. Device damage is plausible. A
SCL 10 SCL is stuck high. No I2C communication with the device is possible. B