SFFS592 August   2024 LM2936Q-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC Package
    2. 2.2 TO-252 Package
    3. 2.3 VSSOP Package
    4. 2.4 SOT-223 Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC Package
    2. 4.2 TO-252 Package
    3. 4.3 VSSOP Package
    4. 4.4 SOT-223 Package

SOIC Package

Figure 4-1 shows the LM2936Q-Q1 pin diagram for the SOIC package. For a detailed description of the device pins, see the Pin Configuration and Functions section in the LM2936Q-Q1 data sheet.

LM2936Q-Q1 Pin Diagram (SOIC) Package LM2936Q-Q1 Pin Diagram (SOIC) Package Figure 4-1 Pin Diagram (SOIC) Package
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OUT 1 Device cycles in and out of thermal shutdown depending upon input voltage. Short circuit current limit triggers to clamp output current. B
GND 2 No effect. Normal operation. D
GND 3 No effect. Normal operation. D
NC 4 No effect. Normal operation. D
SD, NC 5 Shutdown is forced off, enabling the device permanently. SD control is lost. B
No effect. Normal operation. D
GND 6 No effect. Normal operation. D
GND 7 No effect. Normal operation. D
IN 8 Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OUT 1 Power not driven to load. Device is unloaded. D
GND 2 Marginal thermal performance degradation is possible. Normal operation. C
GND 3 Marginal thermal performance degradation is possible. Normal operation. C
NC 4 No effect. Normal operation. D
SD, NC 5 Shutdown is forced off, enabling the device permanently. SD control is lost. B
No effect. Normal operation. D
GND 6 Marginal thermal performance degradation is possible. Normal operation. C
GND 7 Marginal thermal performance degradation is possible. Normal operation. C
IN 8 Device not powered. Device not functional. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effects Failure Effect Class
OUT 1 GND Device cycles in and out of thermal shutdown depending upon input voltage. Short circuit current limit triggers to clamp output current. B
GND 2 GND No effect. Normal operation. D
GND 3 NC No effect. Normal operation. D
SD, NC 5 GND Shutdown is forced off, enabling the device permanently. SD control is lost. B
No effect. Normal operation. D
GND 6 GND No effect. Normal operation. D
GND 7 IN Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
Table 4-5 Pin FMA for Device Pins Short-Circuited to IN
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
OUT 1 Device shuts off as OUT and is now higher than setpoint. Output is no longer regulated. B
GND 2 Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
GND 3 Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
NC 4 No effect. Normal operation. D
SD, NC 5 Device shuts down. B
No effect. Normal operation. D
GND 6 Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
GND 7 Device not powered. Device not functional. Absolute maximum voltages can potentially permanently damage the device. A
IN 8 No effect. Normal operation. D