SFFS634 October 2023 TPS1210-Q1
This section provides a Failure Mode Analysis (FMA) for the pins of the TPS1210-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Class | Failure Effects |
---|---|
A | Potential device damage that affects functionality |
B | No device damage, but loss of functionality |
C | No device damage, but performance degradation |
D | No device damage, no impact to functionality or performance |
Figure 4-1 shows the TPS1210-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the TPS1210-Q1 data sheet.
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
EN/UVLO | 1 | Normal operation. The device is disabled. | B |
INP2 | 2 | Normal operation. The G2 output is low and the external FET is off. | B |
INP1 | 3 | Normal operation. The G1PD output is low and the external FET is off. | B |
N.C. | 4 | Normal operation. | B |
FLT | 5 | Overcurrent, UVLO, Charge pump UVLO fault diagnostic cannot be reported. | B |
GND | 6 | Normal operation | D |
CS_SEL | 7 | Normal operation with current sensing configured for high side sensing | B |
ISCP | 8 | SCP threshold sets to minimum threshold. | B |
TMR | 9 | Overcurrent does not get detected hence overcurrent protection gets disabled. | B |
SCP_TEST | 10 | Normal operation. | B |
G2 | 11 | With G2 grounded, if the pin voltage between SRC and G2 exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
BST | 12 | Gate Driver supply does not come up. FETs remain OFF. | B |
SRC | 13 | Short to GND protection kicks in. | B |
G1PD | 14 | With G1PD grounded, if the pin voltage between SRC and PD exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
G1PU | 15 | Gate Driver supply gets short circuited. FETs remain OFF. | B |
CS- | 17 | Short to GND protection kicks in. | B |
CS+ | 18 | With CS+ grounded, if the pin voltage between CS+ and CS– exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
N.C | 19 | Normal operation. | D |
VS | 20 | Device supply grounded. Device does not power up. | B |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
EN/UVLO | 1 | Internal pulldown brings EN/UVLO to low disabling the device. | B |
INP2 | 2 | Internal pulldown brings INP2 to low, pulling G2 output low. | B |
INP1 | 3 | Internal pulldown brings INP1 to low, pulling G1PD output low. | B |
N.C. | 4 | Normal operation. | B |
FLT | 5 | Overcurrent, UVLO, Charge pump UVLO fault diagnostic cannot be reported. | B |
GND | 6 | Device does not power up and is disabled. | B |
CS_SEL | 7 | Internal pulldown brings CS_SEL to low, resulting in normal operation with current sensing configured for high side sensing. | B |
ISCP | 8 | SCP threshold sets to maximum threshold. | B |
TMR | 9 | Overcurrent response time and auto-retry duration gets reduced to device minimum setting. | C |
SCP_TEST | 10 | Internal pulldown brings CS_SEL to low, resulting in normal operation. | B |
G2 | 11 | G2 output does not get controlled. | B |
BST | 12 | External FET can get turned ON and OFF repetitively due to no capacitor connection at BST pin. | B |
SRC | 13 | The external FET does not turned OFF as the FET source got disconnected from the internal pulldown driver. | B |
G1PD | 14 | The external FET does not turn OFF as the FET GATE disconnects from the internal pulldown driver. | B |
G1PU | 15 | The external FET does not turn OFF as the FET GATE disconnects from the internal pulldown driver. | B |
CS- | 17 | CS- gets internally clamped to CS+ minus 2 diode drops. If ISCP feature is used, then the external FET may not turn ON due to false over current detection. | B |
CS+ | 18 | ISCP feature will not work. | B |
N.C | 19 | Normal operation. | D |
VS | 20 | Device does not get powered up and is disabled. | B |
Pin Name | Pin No. | Shorted to | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|---|
EN/UVLO | 1 | 2 (INP2) | If EN/UVLO is driven high then INP2 also gets detected high making the G2 output high. | B |
INP2 | 2 | 3 (INP1) | If INP2 is driven high then INP1 also gets detected high making the G1PU and G2 output high. | B |
INP1 | 3 | 4 (N.C.) | Normal operation. | B |
N.C. | 4 | 5 (FLT) | Normal operation. | B |
FLT | 5 | 6 (GND) | Fault events do not get indicated. | B |
GND | 6 | 7 (CS_SEL) | Normal operation. Device gets configured for high side sensing. | B |
CS_SEL | 7 | 8 (ISCP) | With CS_SEL grounded then SCP threshold sets to minimum threshold. With CS_SEL pulled high then SCP threshold sets to maximum threshold. | C |
ISCP | 8 | 9 (TMR) | TMR and ISCP thresholds get affected. External FET shuts off at a different threshold than set by ISCP. During an overcurrent fault the device is in Latch-off mode if ISCP has a < 100 kΩ resistor. | C |
TMR | 9 | 10 (SCP_TEST) | SCP_TEST feature gets disabled. | B |
G2 | 11 | 12 (BST) | When INP2 is driven high, BST (Gate driver supply) gets loaded through the internal G2 pulldown switch. Gate driver UVLO hits resulting in turning off the external FETs. | B |
BST | 12 | 13 (SRC) | Gate drive supply gets shorted and external FETs do not turn ON. | B |
SRC | 13 | 14 (G1PD) | Shorting of the pulldown switch (between G1PD and SRC) of the internal gate driver. External FET remains OFF. | B |
G1PD | 14 | 15 (G1PU) | Turn ON and OFF speeds of the external FETs can get impacted. | C |
CS- | 17 | 18 (CS+) | Bypasses the external current sense resistor or FET VDS sensing based on application circuit. SCP features get disabled. | B |
CS+ | 18 | 19 (N.C) | Normal operation. | D |
N.C | 19 | 20 (VS) | Normal operation. | D |
Pin Name | Pin No. | Description of Potential Failure Effect(s) | Failure Effect Class |
---|---|---|---|
EN/UVLO | 1 | EN/UVLO pin is supply rated. Device remains enabled. | B |
INP2 | 2 | INP2 pin is supply rated and will be treated driven high. | B |
INP1 | 3 | INP1 pin is supply rated and will be treated driven high. | B |
N.C. | 4 | Normal operation. | A |
FLT | 5 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
GND | 6 | Supply power is bypassed and device does not turn on. | B |
CS_SEL | 7 | CS_SEL pin is supply rated. Device gets configured for low side current sensing. | B |
ISCP | 8 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
TMR | 9 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
SCP_TEST | 10 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
G2 | 11 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
BST | 12 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
SRC | 13 | Output stuck on to supply | B |
G1PD | 14 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
G1PU | 15 | If pin voltage exceeds the pin data sheet range, it can cause device damage due to voltage breakdown on ESD circuit. | A |
CS- | 17 | In the application, the external sense resistor or FET VDS sensing gets bypassed. short circuit protection will not work. | A |
CS+ | 18 | No effect. Normal operation. | D |
N.C | 19 | No effect. Normal operation. | D |
VS | 20 | No effect. Normal operation. | D |